MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
XCZU17EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245			CMOS	.85 V			R-PBGA-B1517	4	e1
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS	1.2 V		.65 mm	S-PBGA-B161	3	e1
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS	1.2 V		.65 mm	S-PBGA-B161	3	e1
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.17 mm	10.4 mm				NOT SPECIFIED	260	10.4 mm	1572864	CMOS	1.2 V		.65 mm	S-PBGA-B161	3	e1
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	3.34 mm	17.78 mm					250	26.67 mm		CMOS	3.3 V		1.27 mm	R-XXMA-N47		e4
DLPC230TZDQQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100	GRID ARRAY		1.045 V	105 Cel	-40 Cel		BOTTOM	2.352 mm	23 mm						23 mm		CMOS	1.1 V		1 mm	S-PBGA-B324
DLPC3434CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	7 mm				30	260	7 mm		CMOS			.4 mm	S-PBGA-B176	3	e1
ADUCM331WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS		SPI	.5 mm	S-XQCC-N32
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM	1 mm	7 mm						7 mm		CMOS	3.3 V		.65 mm	S-PBGA-B100
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER		1.7 V	95 Cel	-40 Cel		QUAD	.5 mm	1.6 mm					260	1.6 mm		CMOS				S-PQCC-N8	1
CC-WMX-J97C-TN	Digi International	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES			GRID ARRAY			70 Cel	-20 Cel		BOTTOM		50 mm						50 mm		CMOS			2 mm	S-XBGA-N400
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES			GRID ARRAY			85 Cel	-40 Cel		BOTTOM		50 mm						50 mm		CMOS			2 mm	S-XBGA-N400
SIP007AFS001	Samsung	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED	271		RECTANGULAR	UNSPECIFIED	NO	5 V		MICROELECTRONIC ASSEMBLY		3.7 V	70 Cel	0 Cel		UNSPECIFIED	3.45 mm	36 mm						49 mm		CMOS	4.2 V		1.13 mm	R-XXMA-X271
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm		CMOS	3.3 V			R-XXMA-N28
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.3 V			R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm		CMOS	3.3 V			R-XXMA-N28
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B144
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		3 V	85 Cel	-40 Cel		UPPER						NOT SPECIFIED	NOT SPECIFIED			CMOS	3.3 V			S-XUUC-N188
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm		CMOS	1.15 V	I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.6 V			R-XXMA-N28
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.6 V			R-XXMA-N28
MKW01Z128CHNR	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD							40	260								3	e4
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm		CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
ADSP-21584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm		CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm						5 mm		CMOS	1.8 V		.4 mm	S-PQCC-N40
XAZU11EG-1FFVF1517Q	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER							30	245								4	e1
XAZU7EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm		0		30	245	31 mm		CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XAZU11EG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER							30	245								4	e1
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm		0		30	245	31 mm		CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA896(UNSPEC)				TIN SILVER COPPER	BOTTOM										CMOS				S-PBGA-B896		e1
XCVM1402-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm						40 mm		CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVM1402-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm						40 mm		CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVM1402-1MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm						40 mm		CMOS	.8 V		.92 mm	S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.