MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVM1402-2LLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1402-2MLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1502-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVM1502-1LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVM1502-2LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVM1502-2MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVM1802-1LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-1MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760	e1
XCVM1402-1LSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1402-1MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1502-2LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVM1802-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-2MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1302-1LSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1302-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1302-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1302-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1502-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVM1502-1MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVM1502-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVM1502-2MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVM1802-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-1LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760	e1
XCVM1802-1MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	3.89 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.