NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 328

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TDA8029HL/C207,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8/5,3/5

FLATPACK

QFP32,.35SQ,32

90 Cel

-40 Cel

QUAD

260

Other Microprocessor ICs

.8 mm

S-PQFP-G32

1

Not Qualified

MFRC53001T/0FE,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP32,.4

85 Cel

-25 Cel

DUAL

250

40 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G32

3

Not Qualified

TDA8026ET/C2,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

30

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

e1

TDA8026ET/C2,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

TDA8026ET/C2,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

MF0ICU1001W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1001W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1101W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1101W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

TDA8035HN/C1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

85 Cel

-25 Cel

QUAD

1 mm

5 mm

260

5 mm

CMOS

220 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC52301HN1,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

30

260

10 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

e4

MFRC52301HN1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

30

260

10 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

e4

MFRC52201HN1,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

100 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC52202HN1,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

100 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

TEA1792T/N1,118

NXP Semiconductors

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE

SOP8,.25

DUAL

260

20 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

1

Not Qualified

TEA1792TS/1,115

NXP Semiconductors

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

DUAL

260

20 V

Other Microprocessor ICs

.95 mm

R-PDSO-G6

1

Not Qualified

MFRC63102HN,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC63102HN,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

MFRC63102HN,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

MFRC63102HN,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

TEA1792ATS/1,115

NXP Semiconductors

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

DUAL

260

1.2 mA

20 V

Other uPs/uCs/Peripheral ICs

.95 mm

R-PDSO-G6

1

Not Qualified

SLRC61002HN,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

SLRC61002HN,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

SLRC61002HN,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

SLRC61002HN,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

PR601HL/C1,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3,5

FLATPACK

QFP100,.63SQ,20

70 Cel

-25 Cel

QUAD

Other Microprocessor ICs

.5 mm

S-PQFP-G100

Not Qualified

MF0UL1101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL1101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL2101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL2101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

SL2MOS5301EV,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Microprocessor ICs

Not Qualified

SL2MOS5401EV,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Microprocessor ICs

Not Qualified

PN7120A0EV/C10801E

NXP Semiconductors

OTHER

BALL

49

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8

GRID ARRAY, FINE PITCH

BGA49,7X7,20

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

30

260

1.8 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PBGA-B49

3

Not Qualified

e1

TDA8007BHL/C4,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

SDIO101AIHRE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

260

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

2

SDIO101AIHRZ

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

260

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

2

LH79520N0M000B1

NXP Semiconductors

COMMERCIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

70 Cel

0 Cel

QUAD

Other uPs/uCs/Peripheral ICs

.4 mm

S-PQFP-G176

Not Qualified

LH7A400N0E000B3A

NXP Semiconductors

COMMERCIAL

BALL

256

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA256,16X16,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B256

Not Qualified

LH7A404N0E000B0A

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

HTCM400/EAE,122

NXP Semiconductors

OTHER

27

PLASTIC/EPOXY

5

MICROELECTRONIC ASSEMBLY

MODULE,27LEAD,1

85 Cel

-25 Cel

100 mA

5 V

Other uPs/uCs/Peripheral ICs

Not Qualified

P82B715TD,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

12 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

BIPOLAR

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

PCA9504ADGG,112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

PCA9504ADGG,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

TDA8002CG/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP32,.28SQ,20

3 V

85 Cel

-25 Cel

TIN

QUAD

1.6 mm

5 mm

5 mm

CMOS

140 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G32

3

Not Qualified

e3

TDA8002CT/A/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

TDA8002CT/B/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

TDA8002CT/C/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

3

Not Qualified

e4

TDA8002CT/C/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

3

Not Qualified

e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.