NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 328

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
LS1043ASN7MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1043ASN8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ASE8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ASE8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ASN7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1043ASN8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm	40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
LS1043ABE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ACE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
MIMX8MQ6DVAJZIB	NXP Semiconductors	SoC															TIN SILVER				40	260						3	e2
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm	40	260	19 mm	CMOS	1.1 V	.8 mm	S-PBGA-B529	3	e2
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm			19 mm	CMOS	1.1 V	.8 mm	S-PBGA-B529
MCIMX6U6AVM08ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
MIMX8MN5DVPIZCA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm			11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm	40	260	11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306	3
MIMX8MN1DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm	40	260	11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306	3
MIMX8MN5DVPIZDA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm			11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306
LS1023AXN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
MIMXRT105SCVL5B	NXP Semiconductors	SYSTEM ON CHIP		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	10 mm			10 mm	CMOS		.65 mm	S-PBGA-B196
PN7150B0HN/C11006E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel		QUAD	1 mm	6 mm		260	6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3
MIMXRT1051CVJ5BR	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	12 mm			12 mm	CMOS		.8 mm	S-PBGA-B196
MCIMX6S5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
LS1023AXE7QQB	NXP Semiconductors	SoC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA621,25X25,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	1 V	.8 mm	S-PBGA-B621	3
MIMX8DL1AVNFZBA	NXP Semiconductors	SoC		BALL	388		SQUARE	PLASTIC/EPOXY	YES									BOTTOM	1.7 mm	15 mm	40	260	15 mm	CMOS			S-PBGA-B388	3
SE051A2HQ1/Z01XEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
SE051P2HQ1/Z011AZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
SE051W2HQ1/Z019TZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
LS1023AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES						105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM			30	250		CMOS			S-PBGA-B621	3	e1
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES						105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm	30	250	21 mm	CMOS		.8 mm	S-PBGA-B621	3	e1
MCIMX6S5EVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
P1025NXE5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA561,27X27,32		125 Cel	-40 Cel		BOTTOM	2.3 mm	23 mm			23 mm	CMOS		.8 mm	S-PBGA-B561	3
P1025NSE5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel		BOTTOM	2.3 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3
P1015NSN5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel		BOTTOM	1.79 mm	23 mm	40	260	23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.