NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 328

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX6Y1CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MKW21Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW31Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS	3.3 V			S-XQCC-N48	3		e4
MF3ICDH2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES		UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3ICDH4101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES		UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3ICDH8101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES		UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MODH2101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MF3MODH2101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MF3MODH4101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MF3MODH8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MF3MODH8101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MPXY8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel		QUAD	2.3 mm	9 mm		NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS	3 V		.65 mm	S-XQCC-N32
MPXY8600DK6T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel		QUAD	2.3 mm	9 mm		NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS	3 V		.65 mm	S-XQCC-N32
JN5169-001-M03-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		2 V	85 Cel	-40 Cel		UNSPECIFIED		16 mm				21 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N27
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6Q4AVT08AE	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.225 V	125 Cel	-40 Cel		BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Q5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289
MCIMX6Y2CVM08AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289
MCIMX6DP4AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP6AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX7D2DVK12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	85 Cel	0 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS	1.225 V		.4 mm	S-PBGA-B488	3
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel	0 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS	1.225 V		.75 mm	S-PBGA-B541	3
MCIMX7D3DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel	0 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS	1.225 V		.4 mm	S-PBGA-B488	3
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel	-20 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS	1.225 V		.4 mm	S-PBGA-B488	3
MCIMX7D5EVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	105 Cel	-20 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS	1.225 V		.75 mm	S-PBGA-B541	3
MCIMX7D7DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel	0 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS	1.225 V		.4 mm	S-PBGA-B488	3
MCIMX7D7DVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	95 Cel	0 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS	1.225 V		.75 mm	S-PBGA-B541	3
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX6Q6AVT08AE	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
LS1043AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1
LS1023AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3		e1
LS1043AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3		e1
LS1023AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	1 V		.8 mm	S-PBGA-B621	3		e1
LS1043AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3		e1
LS1023AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3		e1
LS1023AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	1 V		.8 mm	S-PBGA-B621	3		e1
LS1043AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.