NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 328

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
MCIMX6D5EYM10AER	NXP Semiconductors	SoC	OTHER	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6X1EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVN10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS		.8 mm	S-PBGA-B529	3	e1
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
LS1043ASE7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	CHIP CARRIER		1.7 V	95 Cel	-40 Cel		QUAD	.5 mm	1.6 mm			260	1.6 mm	CMOS			S-PQCC-N8	1
MCIMX280CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX280DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX283DVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX286CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MIMX8DX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3	e2
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3	e2
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3	e1
MKW01Z128CHNR	NXP Semiconductors	MICROPROCESSOR CIRCUIT														NICKEL GOLD					40	260						3	e4
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel	-10 Cel	TIN	QUAD	1.6 mm	14 mm		40	260	14 mm	CMOS	1.35 V	.4 mm	S-PQFP-G128	3	e3
MIMX8DX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3	e2
MIMX8DX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS	1.1 V	.8 mm	S-PBGA-B417	3
MIMX8DX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3
MIMX8QX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS	1.1 V	.8 mm	S-PBGA-B417	3
MIMX8QX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3	e2
MIMX8QX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3	e2
MIMX8DX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS	1.1 V	.8 mm	S-PBGA-B417	3
MIMX8QX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm		40	260	17 mm	CMOS	1.1 V	.8 mm	S-PBGA-B417	3
MIMX8DX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
SE050D2HQ1/Z01PAZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS	1.8 V	.4 mm	S-PQCC-N20	1	e4
MIMX8MM5DVTLZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MIMX8MM5DVTLZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
LS1043ASE7MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.