Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Boundary Scan	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU9CG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.42 mm			31 mm					30	245	31 mm			CMOS		.85 V						1 mm		R-PBGA-B900	4			e1
XCZU9EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.42 mm			35 mm					30	245	35 mm			CMOS		.85 V						1 mm		R-PBGA-B1156	4			e1
XCZU9EG-2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.42 mm			31 mm					30	245	31 mm			CMOS		.85 V						1 mm		R-PBGA-B900	4			e1
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel			-40 Cel			QUAD		.9 mm			7 mm							7 mm			CMOS		3.3 V						.5 mm		S-XQCC-N48
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel			-40 Cel			QUAD		.9 mm			7 mm							7 mm			CMOS		3.3 V						.5 mm		S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel			-40 Cel			QUAD		.9 mm			7 mm							7 mm			CMOS		3.3 V						.5 mm		S-XQCC-N48
MPXY8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel			-40 Cel			QUAD		2.3 mm			9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm			CMOS		3 V						.65 mm		S-XQCC-N32
MPXY8600DK6T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel			-40 Cel			QUAD		2.3 mm			9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm			CMOS		3 V						.65 mm		S-XQCC-N32
LC898124EP2XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel			-30 Cel	TIN SILVER COPPER		BOTTOM		.33 mm			1.3 mm					30	260	3.89 mm			CMOS		2.8 V						.4 mm		R-PBGA-B27	1			e1
JN5169-001-M03-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED		YES	3.6 V				MICROELECTRONIC ASSEMBLY		2 V	85 Cel			-40 Cel			UNSPECIFIED					16 mm							21 mm			CMOS		3.3 V						1.27 mm		R-XXMA-N27
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8	0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0	YES	TIMER(4), WDT	0	30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH	1.27 mm	FIXED POINT	R-XBCC-B63	3	2400 rpm	YES	e4	8	25
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel			0 Cel			BOTTOM		1.32 mm			14 mm					40	260	14 mm			CMOS								.8 mm		S-PBGA-B289	3
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel			0 Cel			BOTTOM		1.32 mm			14 mm					40	260	14 mm			CMOS								.8 mm		S-PBGA-B289	3
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.61 mm			19 mm					30	250	19 mm			CMOS		.85 V						.8 mm		S-PBGA-B484	3			e1
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.85 V						.8 mm		S-PBGA-B625	3			e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.85 V						.8 mm		S-PBGA-B625	3			e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU2EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.72 V						.8 mm		S-PBGA-B625	3			e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.72 V						.8 mm		S-PBGA-B784	4			e1
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.85 V						.8 mm		S-PBGA-B625	3			e1
XAZU3EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.85 V						.8 mm		S-PBGA-B625	3			e1
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm					30	250	21 mm			CMOS		.72 V						.8 mm		S-PBGA-B625	3			e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.72 V						.8 mm		S-PBGA-B784	4			e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.72 V						.8 mm		S-PBGA-B784	4			e1
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm					30	250	23 mm			CMOS		.72 V						.8 mm		S-PBGA-B784	4			e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel			0 Cel			BOTTOM		1.5 mm			13 mm							13 mm			CMOS		1 V						.8 mm		S-PBGA-B225
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.5 mm			13 mm							13 mm			CMOS		1 V						.8 mm		S-PBGA-B225
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel			0 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel			0 Cel			BOTTOM		1.5 mm			13 mm							13 mm			CMOS		1 V						.8 mm		S-PBGA-B225
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.5 mm			13 mm							13 mm			CMOS		1 V						.8 mm		S-PBGA-B225
XC7Z007S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			0 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel			0 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B485
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B485
XC7Z012S-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel			0 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B485
XC7Z012S-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B485
XC7Z014S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel			0 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z014S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z014S-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel			0 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B484
XC7Z014S-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			19 mm							19 mm			CMOS		1 V						.8 mm		S-PBGA-B484
XC7Z014S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			0 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400
XC7Z014S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			17 mm							17 mm			CMOS		1 V						.8 mm		S-PBGA-B400

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.