Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm			40	260	9 mm		CMOS		.5 mm	S-PBGA-B272	3
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF		30	260	7 mm	81920	CMOS	3 V	.5 mm	S-PQCC-N48	3	e4	30
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm	13 mm			30	260	13 mm		CMOS	1.1 V	.8 mm	S-PBGA-B201	3	e1
EFR32FG12P431F1024GL125-C	Silicon Labs	SYSTEM ON CHIP		BALL	125	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA125,13X13,20	1.62 V	85 Cel	-40 Cel		BOTTOM	.94 mm	7 mm					7 mm		CMOS	1.8 V	.5 mm	S-PBGA-B125
MCIMX6Q6AVT08AE	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			40	260	21 mm		CMOS		.8 mm	S-PBGA-B624	3
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm					35 mm		TSMC		1 mm	S-PBGA-B1152
LS1043AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	21 mm		CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1023AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm		CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
LS1043AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm		CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1023AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	21 mm		CMOS	1 V	.8 mm	S-PBGA-B621	3	e1
LS1043AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm		CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1023AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm		CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
LS1023AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	21 mm		CMOS	1 V	.8 mm	S-PBGA-B621	3	e1
LS1043AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	21 mm		CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm		CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
XC7Z030-1FB484I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm					23 mm		CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-1SB485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm					19 mm		CMOS	1 V	.8 mm	S-PBGA-B485
XC7Z030-2FB484I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm					23 mm		CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm					27 mm		CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm					31 mm		CMOS	1 V	1 mm	S-PBGA-B900
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm			40	260	19 mm		CMOS		.8 mm	S-PBGA-B529	3	e1
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm		48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.3 V		R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm		48 MHz			21.72 mm		CMOS	3.3 V		R-XXMA-N28
XCZU17EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245			CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245			CMOS	.85 V		R-PBGA-B1517	4	e1
MCIMX6Y1DVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm			40	260	9 mm		CMOS		.5 mm	S-PBGA-B272	3
MCIMX6Y1DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm			40	260	14 mm		CMOS		.8 mm	S-PBGA-B289	3	e1
EFR32FG12P431F1024IM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	125 Cel	-40 Cel		QUAD	.9 mm	7 mm					7 mm		CMOS	1.8 V	.5 mm	S-XQCC-N48
EFR32FG12P231F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V	.4 mm	S-XQCC-N68
EFR32FG12P231F512GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V	.4 mm	S-XQCC-N68
EFR32FG12P431F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm			30	260	8 mm		CMOS	1.8 V	.4 mm	S-XQCC-N68	3
EFR32FG12P431F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V	.4 mm	S-XQCC-N68
EFR32FG12P433F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V	.4 mm	S-XQCC-N68
EFR32BG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm					7 mm		CMOS	1.8 V	.5 mm	S-XQCC-N48
AX8052F143-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V	.5 mm	R-PQCC-N40	1	e4
AX8052F143-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm			30	260	7 mm		CMOS	3 V	.5 mm	R-PQCC-N40	1
AX8052F143-3-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V	.5 mm	R-PQCC-N40	1	e4
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm	10.4 mm			30	260	10.4 mm	1572864	CMOS	1.2 V	.65 mm	S-PBGA-B161	3	e1
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm	10.4 mm			30	260	10.4 mm	1572864	CMOS	1.2 V	.65 mm	S-PBGA-B161	3	e1
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100	GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.17 mm	10.4 mm			NOT SPECIFIED	260	10.4 mm	1572864	CMOS	1.2 V	.65 mm	S-PBGA-B161	3	e1
LS1088ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm		CMOS	1.025 V	.8 mm	S-PBGA-B780	3	e1
AX8052F131-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V	.5 mm	S-PQCC-N28	1	e4
AX8052F131-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC40,.2X.28,20	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V	.5 mm	R-PQCC-N40	1	e4
AX8052F131-3-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V	.5 mm	S-PQCC-N28	1	e4
AX8052F131-3-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm			30	260	7 mm		CMOS	3 V	.5 mm	R-PQCC-N40	1
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	3.34 mm	17.78 mm				250	26.67 mm		CMOS	3.3 V	1.27 mm	R-XXMA-N47		e4
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm			40	260	14 mm		CMOS		.8 mm	S-PBGA-B289	3	e1
DLPC230TZDQQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100	GRID ARRAY		1.045 V	105 Cel	-40 Cel		BOTTOM	2.352 mm	23 mm					23 mm		CMOS	1.1 V	1 mm	S-PBGA-B324

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.