Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel	-10 Cel	TIN	QUAD	1.6 mm	14 mm				40	260	14 mm	CMOS	1.35 V		.4 mm	S-PQFP-G128	3	e3
MIMX8DX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3	e2
MIMX8DX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8DX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
MIMX8QX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8QX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3	e2
MIMX8QX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3	e2
MIMX8DX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8QX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8DX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
ST33HTPH2X32AHD4	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel	-40 Cel		QUAD	1 mm	5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE			NOT SPECIFIED	NOT SPECIFIED	5 mm	CMOS	1.8 V		.5 mm	S-XQCC-N32
EFR32MG22C224F512GN32-C	Silicon Labs	SYSTEM ON CHIP															NICKEL PALLADIUM GOLD							40	260							2	e4
XAZU11EG-1FFVF1517Q	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER							30	245							4	e1
XAZU7EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm		0		30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XAZU11EG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER							30	245							4	e1
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.97 mm	31 mm		0		30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
AGFA006R16A3E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM													R-PBGA-B1546
AGFA006R16A2E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM													R-PBGA-B1546
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS	3.8 V		1 mm	R-XXMA-N50	1
BM83SM1-00TA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS	3.8 V		1 mm	R-XXMA-N50	1
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm				40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm				40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3	e1
SE050D2HQ1/Z01PAZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm				30	260	3 mm	CMOS	1.8 V		.4 mm	S-PQCC-N20	1	e4
CY8C4247AZS-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel		QUAD	1.6 mm	10 mm						10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C4246AZS-M443	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel		QUAD	1.6 mm	7 mm						7 mm	CMOS	1.8 V		.5 mm	S-PQFP-G48	3
MIMX8MM5DVTLZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm				40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3	e2
MIMX8MM5DVTLZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm				40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3	e2
2751807	Phoenix Contact	MICROCONTROLLER		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		FLATPACK		4.5 V				QUAD									CMOS	5 V			R-PQFP-G100
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS			1.27 mm	R-PDSO-G8		e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS			1.27 mm	R-PDSO-G8		e4
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS			.5 mm	R-PDSO-N8		e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS			.5 mm	R-PDSO-N8		e4
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS			.5 mm	R-PDSO-N8		e4
ATECC608B-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS			.5 mm	R-PDSO-N8		e4
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	3.8 V		MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel	-40 Cel		UNSPECIFIED	2.4 mm	12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE					15 mm	CMOS	3 V		1.2 mm	R-XXMA-N31	3
LS1043ASE7MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3	e1
LS1043ASN7MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3	e1
LS1043ASN8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3	e1
LS1043ASE8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3	e1
LS1043ASE8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3	e1
LS1043ASN7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3	e1
LS1043ASN8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3	e1
CY8C4147AZE-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm						10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZS-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	1.6 mm	10 mm						10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQE-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQE-S473T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.