Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
CY8C4147AZE-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4147AZE-S285T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4147AZE-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4147AZS-S295T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4147LQA-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQA-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQA-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQS-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQS-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146LQS-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146LQS-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147AZE-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4147AZE-S475T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4147AZS-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4147LQA-S283T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQE-S243T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQE-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQE-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQS-S243T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQS-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm	40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
LS1043ABE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ACE9MQB	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
MIMX8MQ6DVAJZIB	NXP Semiconductors	SoC															TIN SILVER				40	260						3	e2
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA896(UNSPEC)				TIN SILVER COPPER	BOTTOM						CMOS			S-PBGA-B896		e1
EFR32MG21B010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	4 mm			4 mm	CMOS	3 V	.4 mm	S-XQCC-N32
TA100-Y230C2X01-00T-VAO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	SMALL OUTLINE	SOP8,.23	2.7 V	125 Cel	-40 Cel		DUAL	1.75 mm	3.9 mm			4.9 mm	CMOS		1.27 mm	R-PDSO-G8
NRF9160-SIBA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm			16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SICA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm			16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SIBA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm			16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SICA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm			16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm	40	260	19 mm	CMOS	1.1 V	.8 mm	S-PBGA-B529	3	e2
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm			19 mm	CMOS	1.1 V	.8 mm	S-PBGA-B529
MCIMX6U6AVM08ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
XCVM1402-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1402-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-1MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2LLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVM1402-2MLEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	3.75 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1402-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-2MSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	3.75 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVM1502-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.