Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6X1EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVN10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3	e1
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS			.8 mm	S-PBGA-B529	3	e1
DLPC3434CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	7 mm		30	260	7 mm	CMOS			.4 mm	S-PBGA-B176	3	e1
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3	e1
LS1043ASE7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3	e1
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
ADUCM331WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm		NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS		SPI	.5 mm	S-XQCC-N32
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3	e1
XCZU46DR-1FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-1FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-1FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-2FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-2FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-2FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-2FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU46DR-L1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU46DR-L1FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU46DR-L2FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU46DR-L2FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.72 V			R-PBGA-B1760	4	e1
XCZU47DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU47DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU47DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU47DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU47DR-L1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU47DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU47DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU47DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V			R-PBGA-B1517	4	e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.