Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
ST33HTPH2E32AAF1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel	-40 Cel		QUAD	1 mm	5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE					5 mm	CMOS	1.8 V		.5 mm	S-XQCC-N32
ATWINC1500-MR210PB1952-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.3 V		1.016 mm	R-XXMA-N28
SIP007AFS001	Samsung	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED	271		RECTANGULAR	UNSPECIFIED	NO	5 V		MICROELECTRONIC ASSEMBLY		3.7 V	70 Cel	0 Cel		UNSPECIFIED	3.45 mm	36 mm						49 mm	CMOS	4.2 V		1.13 mm	R-XXMA-X271
MCIMX280CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX280DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX283DVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX286CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
XC7Z015-1CL485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
MIMX8DX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3	e2
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3	e2
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel		BOTTOM	.6 mm	5 mm						5 mm	CMOS	3.3 V		.5 mm	S-PBGA-B64
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V			R-XXMA-N28
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.3 V			R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V			R-XXMA-N28
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm	CMOS	1.8 V		.65 mm	S-PBGA-B144
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		3 V	85 Cel	-40 Cel		UPPER						NOT SPECIFIED	NOT SPECIFIED		CMOS	3.3 V			S-XUUC-N188
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm				40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3	e2
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3	e1
XC7Z045-1FBG676CES	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm						27 mm	CMOS	1 V		1 mm	S-PBGA-B676
66AK2G12ABYT100	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm				30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3	e1
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm	CMOS	1.15 V	I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.6 V			R-XXMA-N28
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.6 V			R-XXMA-N28
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3	e1
MKW01Z128CHNR	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD							40	260							3	e4
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3	e1
ADSP-21584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
EFR32MG13P732F512IM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.62 V	125 Cel	-40 Cel		QUAD	.9 mm	7 mm						7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32MG13P733F512IM48-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.62 V	125 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm	7 mm				40	260	7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48	2	e3
EFR32FG13P232F512GM48-D	Silicon Labs	SoC															MATTE TIN							40	260							2	e3
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm						5 mm	CMOS	1.8 V		.4 mm	S-PQCC-N40
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm						40 mm	TSMC			1 mm	S-PBGA-B1517

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.