LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFE3-17EA-6LMG328I	Lattice Semiconductor	FPGA		Ball	328	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			116	1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA328,19X19,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B328	3	1.5 mm	10 mm	No		e1	375 MHz	30 s	116	260 °C (500 °F)	10 mm
LFE3-17EA-8LMG328I	Lattice Semiconductor	FPGA		Ball	328	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			116	1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA328,19X19,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B328	3	1.5 mm	10 mm	No		e1	500 MHz	30 s	116	260 °C (500 °F)	10 mm
LFE3-17EA-8MG328C	Lattice Semiconductor	FPGA	Other	Ball	328	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			116	1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA328,19X19,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B328	3	1.5 mm	10 mm	No		e1	500 MHz	30 s	116	260 °C (500 °F)	10 mm
LCMXO2-2000HE-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	2112	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-256HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			55	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	55	250 °C (482 °F)	8 mm
LCMXO2-256ZE-1MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			55	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	55	250 °C (482 °F)	8 mm
LCMXO2-256ZE-1MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			55	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	55	250 °C (482 °F)	8 mm
LCMXO2-4000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			104	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000HC-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HE-4MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000ZE-1MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000ZE-2MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000ZE-3MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-640HC-4MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V			79	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	79	250 °C (482 °F)	8 mm
LCMXO2-640HC-6MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V			79	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	79	250 °C (482 °F)	8 mm
LCMXO2-640ZE-1MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	1.26 V			79	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	79	250 °C (482 °F)	8 mm
LCMXO2-7000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000HC-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000HE-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000HE-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000HE-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000ZE-1BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-7000ZE-1BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HE-4MG184I	Lattice Semiconductor	FPGA		Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			150	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No		e1			150		8 mm
LCMXO2-4000HE-6MG184C	Lattice Semiconductor	FPGA	Other	Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			150	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No		e1			150		8 mm
XC6SLX25T-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	190	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC7A100T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
LCMXO3L-1300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	160			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	540		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.