LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A75T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A75T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A75T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300	0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
LFE5U-25F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	3000				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	85 °C (185 °F)		3000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5U-25F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	3000				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	100 °C (212 °F)		3000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5U-45F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy	44000	Yes	1.155 V	5500			118	1.1			Grid Array, Low Profile, Fine Pitch	BGA285,18X18,20		1.045 V	.5 mm	85 °C (185 °F)		5500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s	118	260 °C (500 °F)	10 mm
LFE5U-85F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	85 °C (185 °F)		10500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5U-85F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	100 °C (212 °F)		10500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5UM-85F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	100 °C (212 °F)		10500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LCMXO3L-2100C-5BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LCMXO3L-6900C-5BG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			335	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s	335	260 °C (500 °F)	17 mm
LAMXO2280E-3FTN324E	Lattice Semiconductor	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	2280	Yes	1.26 V	285		AEC-Q100	271	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	19 mm	No		e1		30 s	271	260 °C (500 °F)	19 mm
XC6SLX16-2CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		160	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-2CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		160	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		232	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	232	260 °C (500 °F)	15 mm
XC6SLX16-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		232	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	232	260 °C (500 °F)	15 mm
XC6SLX16-3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		160	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		160	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		232	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	232	260 °C (500 °F)	15 mm
XC6SLX16-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		232	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	232	260 °C (500 °F)	15 mm
XC6SLX16-L1CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS		160	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1		30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS		232	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	232	260 °C (500 °F)	15 mm
XC6SLX16-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS		232	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	232	260 °C (500 °F)	15 mm
XC6SLX25-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		226	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		226	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		226	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		226	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		226	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	226	260 °C (500 °F)	15 mm
XC6SLX25T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX25T-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX25T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX25T-4CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes			CMOS		190			1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm
XC6SLX4-2CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		120	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	120	260 °C (500 °F)	13 mm
XC6SLX4-2CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		120	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	120	260 °C (500 °F)	13 mm
XC6SLX4-3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		120	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	120	260 °C (500 °F)	13 mm
XC6SLX4-3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		132	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	132	260 °C (500 °F)	13 mm
XC6SLX4-L1CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.05 V	300	CMOS		132	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1		30 s	132	260 °C (500 °F)	13 mm
XC6SLX4-L1CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.05 V	300	CMOS		120	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1		30 s	120	260 °C (500 °F)	13 mm
XC6SLX45-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		218	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	218	260 °C (500 °F)	15 mm
XC6SLX45-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		218	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	218	260 °C (500 °F)	15 mm
XC6SLX45-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		218	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	218	260 °C (500 °F)	15 mm
XC6SLX45-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		218	1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	218	260 °C (500 °F)	15 mm
XC6SLX45T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		190	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-4CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		190			1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.