LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A12T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150	0.95	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-L2CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150	0.9	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A25T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150	0.9	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7S15-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S15-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S15-2CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1286 MHz		100		13 mm
XC7S15-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1286 MHz		100		13 mm
XC7S15-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000		100	0.95	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S25-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		150		13 mm
XC7S25-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		150		13 mm
XC7S25-1CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		150		15 mm
XC7S25-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1286 MHz		150		13 mm
XC7S25-2CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1286 MHz		150		15 mm
XC7S25-2CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1286 MHz		150		15 mm
XC7S25-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		150		13 mm
XC7S25-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		150		15 mm
XC7S50-2CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1286 MHz		250		15 mm
XC7S50-2CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1286 MHz		250		15 mm
XC7S50-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250	0.95	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		250		15 mm
XC7S6-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S6-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S6-2CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1286 MHz		100		13 mm
XC7S6-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1286 MHz		100		13 mm
XC7S6-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469		100	0.95	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S15-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC7S15-1FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		100		15 mm
XC7S15-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		100		15 mm
XC7S15-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		100		15 mm
XC7S15-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		100		15 mm
XC7S25-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		150		13 mm
XC7S25-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		150		15 mm
XC7S25-1FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		150		15 mm
XC7S25-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		150		15 mm
XC7S25-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		150		15 mm
XC7S25-L1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.92 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		150		15 mm
XC7S50-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		250		15 mm
XC7S50-1FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		250		15 mm
XC7S50-1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		250		15 mm
XC7S50-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		250		15 mm
XC7S50-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		250		15 mm
XC7S50-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		250		15 mm
XC7S6-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		100		15 mm
XC7S6-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	85 °C (185 °F)	1.05 ns	469 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		100		15 mm
XC7S6-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40	.95 V	1 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		100		15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.