LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Maximum Clock Frequency	No. of Outputs	Length
LFMXO5-25-9BBG400I	Lattice Semiconductor	FPGA	Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Bottom	S-PBGA-B400	1.7 mm	17 mm		252	17 mm
LFMXO5-25-7BBG256I	Lattice Semiconductor	FPGA	Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Bottom	S-PBGA-B256	1.7 mm	14 mm		160	14 mm
LFMXO5-25-7BBG400C	Lattice Semiconductor	FPGA	Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Bottom	S-PBGA-B400	1.7 mm	17 mm		252	17 mm
LFMXO5-25-7BBG256C	Lattice Semiconductor	FPGA	Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Bottom	S-PBGA-B256	1.7 mm	14 mm		160	14 mm
LFMXO5-25-8BBG400C	Lattice Semiconductor	FPGA	Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Bottom	S-PBGA-B400	1.7 mm	17 mm		252	17 mm
LFMXO5-25-8BBG400I	Lattice Semiconductor	FPGA	Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Bottom	S-PBGA-B400	1.7 mm	17 mm		252	17 mm
LFMXO5-25-9BBG400C	Lattice Semiconductor	FPGA	Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Bottom	S-PBGA-B400	1.7 mm	17 mm		252	17 mm
XC6SLX16-2CS324I4204	Xilinx	FPGA	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139		232	1.2	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.5 mm	15 mm	667 MHz	232	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.