LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL006YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL006YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL006YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL006ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392			176	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial				176		14 mm
10CL010YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL010YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL010YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL010YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL010ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645			176	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial				176		14 mm
10CL016YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL016YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL016YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL016YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL025YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)		1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL025YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL025YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
10CL025ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.03 V	1539			150	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)		1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial				150		14 mm
XA7S25-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.05 V	1825		AEC-Q100; TS 16949		1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.5 mm	15 mm			1098 MHz	30 s		260 °C (500 °F)	15 mm
XC7A25T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
EP2AGX45CU17I5G	Intel	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805			156	.9	Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32	.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B358		1.7 mm	17 mm					156		17 mm
XC7A100T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		210	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm			1098 MHz		210		15 mm
LFD2NX-40-9BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-9BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
XC7A25T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG		150	0.9	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm	Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A25T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A25T-3CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1412 MHz		150		10 mm
XC7A12T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A25T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
XC7A12T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A12T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A75T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm			1098 MHz		300		15 mm
XC7A25T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A12T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
XC7A12T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
XC7A25T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A12T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150	0.9	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm	Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm				30 s	74	260 °C (500 °F)	14 mm
MPF200TS-FCS325M	Microchip Technology	FPGA	Military	Ball	325	LFBGA	Rectangular	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		170	1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	R-PBGA-B325		1.45 mm	11 mm	It also Operates at 1.05 V nominal supply				170		14.5 mm
MPF300TS-FCS536M	Microchip Technology	FPGA	Military	Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		300	1	Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20	.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm	It also Operates at 1.05 V nominal supply				300		16 mm
MPF100T-FCSG325E	Microchip Technology	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170	1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm	It also Operates at 1.05 V nominal supply				170		11 mm
MPF050T-1FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS		164	1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm	It also Operates at 1.05 V nominal supply				164		11 mm
MPF050T-FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS		164	1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm	It also Operates at 1.05 V nominal supply				164		11 mm
LFMXO5-25-8BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI		160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm					160		14 mm
LFMXO5-25-9BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI		160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm					160		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.