LFBGA Field Programmable Gate Arrays (FPGA) 440

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M16SCU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
LCMXO3D-4300ZC-2BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	537		206	2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	537 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400HC-5BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400HC-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400HC-5BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400HC-5BG484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5		Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm		Also Operates at 3.3 V nominal supply				383		19 mm
LCMXO3D-9400HC-6BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400HC-6BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400HC-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5		Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm		Also Operates at 3.3 V nominal supply				383		19 mm
LCMXO3D-9400HC-6BG484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5		Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm		Also Operates at 3.3 V nominal supply				383		19 mm
LCMXO3D-9400ZC-2BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400ZC-2BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		335	2.5		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400ZC-3BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LIFCL-17-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-7BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
LIFCL-40-8BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
LIFCL-40-9BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-9BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
LIFCL-40-9BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
XC7A50T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	210	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm						210		15 mm
MPF100T-1FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100T-1FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100T-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TL-FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TL-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TLS-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TS-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170	1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF200TS-1FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	300	1		Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF300T-1FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300	1		Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF300TLS-FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300	1		Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
XC6SLX16-N3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	160	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-N3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	160	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX16-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	232	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	232	260 °C (500 °F)	15 mm
XC6SLX25-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	226	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	226	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	226	260 °C (500 °F)	15 mm
XC6SLX25T-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	218	260 °C (500 °F)	15 mm
XC6SLX45-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	218	260 °C (500 °F)	15 mm
XC6SLX45T-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	190	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX9-N3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	160	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX9-N3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	160	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX9-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	200	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	200	260 °C (500 °F)	15 mm
XC7A100T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925		300	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.