LFBGA Field Programmable Gate Arrays (FPGA) 440

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO3LF-6900C-5BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LCMXO3LF-6900C-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	17 mm
LCMXO3LF-6900C-5BG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			335	2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s	335	260 °C (500 °F)	17 mm
LCMXO3LF-6900C-6BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	17 mm
LCMXO3LF-6900C-6BG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			335	2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s	335	260 °C (500 °F)	17 mm
LFE5U-12F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500			118	1.1		Grid Array, Low Profile, Fine Pitch	BGA285,18X18,20		1.045 V	.5 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s	118	260 °C (500 °F)	10 mm
LFE5UM5G-25F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	3000				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5UM5G-45F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	5500				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		5500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5UM5G-45F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	5500				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5UM5G-85F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	10500				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		10500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
XA7A50T-2CPG236I	Xilinx	FPGA		Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		106	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1286 MHz	30 s	106	260 °C (500 °F)	10 mm
XA7A50T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	150	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7A35T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG	AEC-Q100	210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A75T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG	AEC-Q100	210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A35T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A35T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG	AEC-Q100	150	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7A35T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG	AEC-Q100	106	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	125 °C (257 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1098 MHz	30 s	106	260 °C (500 °F)	10 mm
XA7A50T-2CSG325I	Xilinx	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		150	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7A35T-2CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A50T-2CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A50T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A75T-2CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A50T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A50T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	106	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e8	1098 MHz	30 s	106	260 °C (500 °F)	10 mm
XA7A35T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A50T-1CSG325I	Xilinx	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		150	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7A100T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A100T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	AEC-Q100	210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A100T-2CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A15T-1CPG236Q	Xilinx	FPGA	Automotive	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG	AEC-Q100; TS 16949	210	1		Grid Array, Low Profile, Fine Pitch			.95 V	.5 mm	125 °C (257 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	210	260 °C (500 °F)	10 mm
XA7A15T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG		210	1		Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1		30 s	210	260 °C (500 °F)	15 mm
XA7A15T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG	AEC-Q100	210	1		Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1		30 s	210	260 °C (500 °F)	15 mm
XA7A15T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG	AEC-Q100; TS 16949	210	1		Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XA7A15T-2CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG		210	1		Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1		30 s	210	260 °C (500 °F)	15 mm
LCMXO3L-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-9400C-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	17 mm
LCMXO3LF-9400C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			206	2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-9400C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			206	2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XC7A12T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A12T-1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A12T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A12T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A12T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-3CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7A12T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150	0.95		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	10 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.