FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX980T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	76500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX980T-2FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX980T-L2FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	76500 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
LCMXO2-4000HE-4MG184I	Lattice Semiconductor	FPGA		Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			150	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No	e1			150		8 mm
LCMXO2-4000HE-6MG184C	Lattice Semiconductor	FPGA	Other	Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			150	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No	e1			150		8 mm
XC6SLX100-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	338	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	806 MHz		338		19 mm
XC6SLX100T-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	806 MHz	30 s	376	250 °C (482 °F)	27 mm
XC6SLX25T-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	190	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	806 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	806 MHz	30 s	296	250 °C (482 °F)	23 mm
XC6SLX75T-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	268	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	806 MHz	30 s	268	250 °C (482 °F)	23 mm
XC6VLX130T-3FFG784C	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes			CMOS	400			1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B784	4			No	e1	1412 MHz	30 s	400	245 °C (473 °F)
XC6VLX240T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes			CMOS	600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No	e1	1412 MHz	30 s	600	245 °C (473 °F)
XC6VLX75T-3FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V	5820	CMOS	360	1		1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.59 ns	5820 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No	e1	1412 MHz	30 s	360	245 °C (473 °F)	29 mm
XC7A200T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K325T-1FF900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	326080	CMOS	500	1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	326080 CLBS		Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No	e0	1818 MHz		500		31 mm
XC7A100T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-1FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A100T-1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A100T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A100T-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A100T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7A100T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A100T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-3FGG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1412 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A200T-1FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A200T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A200T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A200T-1SBG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A200T-1SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A200T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-2FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A200T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400	1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A200T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1286 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A200T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1286 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A200T-2SBG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A200T-2SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A200T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.