FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5210-5PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	32 mm
XC5210-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	32 mm
XCS30-3PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 30000	e0	125 MHz	30 s	196	225 °C (437 °F)	32 mm
XCS30-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 30000	e0	166 MHz	30 s	196	225 °C (437 °F)	32 mm
XCS30XL-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	32 mm
XCS40-3PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	205	13000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 40000	e0	125 MHz	30 s	205	225 °C (437 °F)	32 mm
XCS40-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	205	13000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 40000	e0	166 MHz	30 s	205	225 °C (437 °F)	32 mm
XCS40XL-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	205	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	32 mm
XC3030L-8VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	54	1500	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3030L-8VQ64I	Xilinx	FPGA	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	54	1500	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	54	240 °C (464 °F)	10 mm
XC7K325T-1FB900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e0		30 s		225 °C (437 °F)	31 mm
XC4010E-1BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-4BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2.7 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	111 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2.7 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	111 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4013E-1BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	166 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-2BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-2BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		1.6 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-4BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2.7 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2.7 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4085XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	289	55000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4036XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e0	227 MHz	30 s	288	225 °C (437 °F)	40 mm
XC4052XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS	352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	40 mm
XC40200XV-07BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS	448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4085XLA-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4003E-1PG120C	Xilinx	FPGA	Other	Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		166 MHz		80		34.544 mm
XC4003E-2PG120C	Xilinx	FPGA	Other	Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		125 MHz		80		34.544 mm
XC4003E-2PG120I	Xilinx	FPGA		Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm		1.6 ns	100 CLBS, 2000 Gates			Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		125 MHz		80		34.544 mm
XC4003E-3PG120C	Xilinx	FPGA	Other	Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		125 MHz		80		34.544 mm
XC4003E-3PG120I	Xilinx	FPGA		Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm		2 ns	100 CLBS, 2000 Gates			Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		125 MHz		80		34.544 mm
XC4003E-4PG120I	Xilinx	FPGA		Pin/Peg	120	HPGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	80	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	100 CLBS, 2000 Gates			Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	Max usable 3000 Logic gates		111 MHz		80		34.544 mm
XC4005E-1PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.3 ns	196 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		166 MHz		112		42.164 mm
XC4005E-2PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		125 MHz		112		42.164 mm
XC4005E-3PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		125 MHz		112		42.164 mm
XC4005E-4PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		111 MHz		112		42.164 mm
XC4005E-4PG156I	Xilinx	FPGA		Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	196 CLBS, 3000 Gates			Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		111 MHz		112		42.164 mm
XC4006E-2PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	256 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		125 MHz		125		42.164 mm
XC4006E-3PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		125 MHz		125		42.164 mm
XC4006E-4PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	256 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		111 MHz		125		42.164 mm
XC4006E-4PG156I	Xilinx	FPGA		Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.5 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	256 CLBS, 4000 Gates			Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		111 MHz		125		42.164 mm
XC4008E-1PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS	144	6000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.3 ns	324 CLBS, 6000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Max usable 8000 Logic gates		166 MHz		144		47.244 mm
XC4008E-2PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS	144	6000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	324 CLBS, 6000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Max usable 8000 Logic gates		125 MHz		144		47.244 mm
XC4008E-3PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS	144	6000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	324 CLBS, 6000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Max usable 8000 Logic gates		125 MHz		144		47.244 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.