FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A200T-3FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A200T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No		e1	1412 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A200T-3SBG484E	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	19 mm
ICE40LP1K-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM49TR	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	37		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B49	3	1 mm	3 mm			e1		30 s	37	260 °C (500 °F)	3 mm
ICE40LP4K-CM81TR	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm			e1		30 s	63	260 °C (500 °F)	4 mm
XC6VHX250T-3FFG1154C	Xilinx	FPGA		Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes			CMOS	320			1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1154	4			No		e1	1412 MHz	30 s	320	245 °C (473 °F)
XC6VHX380T-3FFG1155C	Xilinx	FPGA		Ball	1155	BGA	Square	Plastic/Epoxy	382464	Yes			CMOS	440			1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1155	4			No		e1	1412 MHz	30 s	440	245 °C (473 °F)
XC6VLX130T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes			CMOS	600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1412 MHz	30 s	600	245 °C (473 °F)
XC6VLX195T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes			CMOS	600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1412 MHz	30 s	600	245 °C (473 °F)
XC6VLX195T-3FFG784C	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes			CMOS	400			1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B784	4			No		e1	1412 MHz	30 s	400	245 °C (473 °F)
XC6VLX240T-3FFG1759C	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes			CMOS	720			1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4			No		e1	1412 MHz	30 s	720	245 °C (473 °F)
XC6VLX240T-3FFG784C	Xilinx	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes			CMOS	400			1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B784	4			No		e1	1412 MHz	30 s	400	245 °C (473 °F)
XC6VLX365T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes			CMOS	600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1412 MHz	30 s	600	245 °C (473 °F)
XC6VLX75T-3FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes			CMOS	240			1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	4			No		e1	1412 MHz	30 s	240	250 °C (482 °F)
XC6VSX475T-2FFG1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	840		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm		0.67 ns	37200 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC7K160T-1FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V		CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XC7K160T-2FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V		CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
ICE40LP1K-SWG16TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE40LP1K-SWG16TR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160	CMOS			1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm								1.48 mm
ICE40LP1K-SWG16TR	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE5LP4K-SWG36ITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	26		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm					30 s	26	260 °C (500 °F)	2.078 mm
XC7A200T-2SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		285		1		Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7A200T-1SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		285		1		Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7K410T-2FF900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	31775 CLBS		Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No		e0	1818 MHz		500		31 mm
XC3164-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3164-3PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		270 MHz		110		37.084 mm
XC3164-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3164-4PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz		110		37.084 mm
XC3195-3PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		270 MHz		176		47.244 mm
XC3195-5PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		176		47.244 mm
XC4010D-5PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	8000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4010-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4013-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4013-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	32 mm
XC3030-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3030-100PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz		58		24.2316 mm
XC3030-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3030-100PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	1500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	80	225 °C (437 °F)	20 mm
XC4003-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS	61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4003-6PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS	77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	225 °C (437 °F)	20 mm
XC3042-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3042-100PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	82	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz	30 s	82	225 °C (437 °F)	20 mm
XC4004A-6TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	96	3200	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	144 CLBS, 3200 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	480 flip-flops; typical gates = 3200-4000	e0	90.9 MHz	30 s	96	225 °C (437 °F)	20 mm
XC4005-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC4005-5PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.