Intel Field Programmable Gate Arrays (FPGA) 193

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
10M02SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	246	15 mm
10M04SAU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	246	15 mm
10M04SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	246	15 mm
10M08DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm		250	23 mm
10M08SAE144I7P	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	2.85 V	.5 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Quad	S-PQFP-G144	1.65 mm	20 mm	Also Operates at 3.3 V nominal supply	250	20 mm
10M08SAU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B169	1.55 mm	11 mm	Also Operates at 3.135 V min 3.3 V nominal and 3.465 max VCC	250	11 mm
10M08SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	250	15 mm
10M08SAU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	250	15 mm
10M08SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	250	15 mm
10M16DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm		320	23 mm
10M16DAU324I7P	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	1.15 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm		320	15 mm
10M16SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	320	15 mm
10M16SAU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	320	15 mm
10M16SCU169A7P	Intel	FPGA	Automotive	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B169	1.55 mm	11 mm	Also Operates at 3.3 V nominal supply	320	11 mm
10M16SCU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B169	1.55 mm	11 mm	Also Operates at 3.3 V nominal supply	320	11 mm
10M16SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	320	15 mm
10M16SCU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B324	1.55 mm	15 mm	Also Operates at 3.3 V nominal supply	320	15 mm
10M25DAF256I7P	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2	Grid Array, Low Profile	BGA256,16X16,40	1.15 V	1 mm	100 °C (212 °F)	1563 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B256	1.55 mm	17 mm		360	17 mm
10M50DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)	3125 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B484	2 mm	23 mm		500	23 mm
1SG250HU2F50E1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750		736		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)	302750 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2397	3.881 mm	50 mm		736	50 mm
1SG250HU2F50I1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750		736		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)	302750 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2397	3.881 mm	50 mm		736	50 mm
1SG280HN1F43E1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
1SG280HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
1SG280HN1F43I2LG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes	.88 V	344125		704	0.85	Grid Array	BGA1760,42X42,40	.82 V	1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
1SG280HN3F43E3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
1SG280HN3F43I3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
1SG280HU1F50E1VG	Intel	FPGA	Other	Ball	2397	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		736		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2397	3.881 mm	50 mm		736	50 mm
1SG280HU2F50E2VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		736		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2397	3.881 mm	50 mm		736	50 mm
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1760	3.881 mm	42.5 mm		704	42.5 mm
5AGZME1H2F35I3LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		414	0.85	Grid Array	BGA1152,34X34,40	.82 V	1 mm	100 °C (212 °F)	8302 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm		414	35 mm
EP3SE80F1152C2G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744	0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)	3200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply	744	35 mm
EP3SE80F1152C3G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744	0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)	3200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply	744	35 mm
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200			.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	3200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3.2 mm	29 mm	Also Operates at 1.1 V VCC nominal		29 mm
EP3SL110F1152C4G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		744	0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)	4300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply	744	35 mm
EP3SL150F780C4G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	5700 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply	488	29 mm
EP3SL50F780C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	1900 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply	488	29 mm
10CX085YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B672				216
10CX085YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B672				216
10CX085YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B672				216
10CX085YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B672				216
10CX085YU484E6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B484				188
10CX085YU484I5G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	31000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B484				188
10CX105YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B672				236
10CX105YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B672				236
10CX105YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B672				236
10CX105YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B672				236
10CX105YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780				284
10CX105YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780				284

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.