Intel Field Programmable Gate Arrays (FPGA) 193

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CX105YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484							188
10CX105YU484I5G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484							188
10CX105YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484							188
10CX150YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672							236
10CX150YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672							236
10CX150YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672							236
10CX150YF780E5G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780							284
10CX150YF780I5G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780							284
10CX150YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484							188
10CX150YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484							188
10CX220YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672							236
10CX220YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	236	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672							236
10CX220YF780E5G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780							284
10CX220YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780							284
10CX220YF780I5G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780							284
10CX220YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780							284
10CX220YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484							188
10CX220YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484							188
10CL006YU256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Grid Array		1.15 V		85 °C (185 °F)	392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256
10CL016YU484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array		1.15 V		85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484
10CL006YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	125 °C (257 °F)	392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL006YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL006YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL006YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm		e3	30 s		260 °C (500 °F)	20 mm
10CL006YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL006YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL006YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL006ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		176	1	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	.97 V	.5 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	-40 to 125 °C range is available as extended industrial			176		20 mm
10CL006ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		176	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial			176		14 mm
10CL010YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	125 °C (257 °F)	645 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL010YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL010YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm		e3	30 s		260 °C (500 °F)	20 mm
10CL010YM164C6G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Thin Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10CL010YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Thin Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10CL010YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Thin Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10CL010YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL010YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL010YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL010YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL010ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176	1	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	.97 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	-40 to 125 °C range is available as extended industrial			176		20 mm
10CL010ZM164I8G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176	1	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	.97 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm	-40 to 125 °C range is available as extended industrial			176		8 mm
10CL010ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial			176		14 mm
10CL016YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	125 °C (257 °F)	963 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL016YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL016YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm		e3	30 s		260 °C (500 °F)	20 mm
10CL016YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL016YF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL016YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.