Intel Field Programmable Gate Arrays (FPGA) 193

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	JESD-609 Code	No. of Outputs	Length
5AGXFA5H4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152	2.7 mm	35 mm			544	35 mm
5AGXFB5K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)	15849 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
5AGXFB7H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	504000	Yes	1.18 V	19024	TSMC	704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152	2.7 mm	35 mm			704	35 mm
5AGXFB7K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)	19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
5SGXEABN1F45I2G	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	TSMC	840	.9	Grid Array	BGA1932,44X44,40	.87 V	1 mm	100 °C (212 °F)	35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932	3.85 mm	45 mm			840	45 mm
EP4SGX230KF40C2G	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120		744	.9	Grid Array	BGA1517,39X39,40	.87 V	1 mm	85 °C (185 °F)	9120 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517	3.5 mm	40 mm				40 mm
10AX027E1F29I1HG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.98 V	10162	TSMC	360	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780	3.35 mm	29 mm			360	29 mm
10AT090S2F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962		624	.9	Grid Array	BGA1932,44X44,40	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932	3.5 mm	45 mm	Also Operates at 0.95 VCC nominal		624	45 mm
10AX016E3F27E1HG	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes		6151	TSMC	240		Grid Array	BGA672,26X26,40		1 mm	100 °C (212 °F)	6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672	3.35 mm	27 mm			240	27 mm
10AX066N2F40E1HG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588		Grid Array	BGA1517,39X39,40		1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517	3.35 mm	40 mm			588	40 mm
10CL080ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial		423	19 mm
10CL080ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.4 mm	23 mm	-40 to 125 °C range is available as extended industrial		423	23 mm
5AGXBB1D4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)	11321 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
5AGTFD3H3F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688		704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152	2.7 mm	35 mm			704	35 mm
5AGXMB3G6F40C6G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
5AGXMA7G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	9168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152	2.7 mm	35 mm			544	35 mm
5AGXMA5G4F31I5G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA896,30X30,40	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896	2.7 mm	31 mm			544	31 mm
5AGXMA5G4F31C4G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	7170 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896	2.7 mm	31 mm			544	31 mm
5AGXMA5G4F31I3G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.18 V	7170	TSMC	544	1.15	Grid Array, Heat Sink/Slug	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896	2.7 mm	31 mm			544	31 mm
5AGXMA3D4F27I5G	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1	Grid Array, Heat Sink/Slug	BGA672,26X26,40	1.07 V	1 mm	100 °C (212 °F)	5890 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672	2.7 mm	27 mm			416	27 mm
5AGXMA5G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152	2.7 mm	35 mm			544	35 mm
5AGXMA3D4F31C5G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1	Grid Array, Heat Sink/Slug	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	5890 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896	2.7 mm	31 mm			416	31 mm
5AGXFB3H4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
5AGXFB1H4F40C5G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	11321 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517	2.7 mm	40 mm			704	40 mm
1SD280PT1F55I1VG	Intel	FPGA	Industrial	Ball	2912	BGA	Square	Plastic/Epoxy	2800000	Yes				816		Grid Array	BGA2912,54X54,40		1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B2912	3.881 mm	55 mm			816	55 mm
1ST280EU2F50I2VG	Intel	FPGA	Industrial	Ball	2397	BGA	Square	Plastic/Epoxy	2800000	Yes		350000		440		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)	350000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B2397	3.881 mm	50 mm		e1	440	50 mm
1ST280EY2F55E1VG	Intel	FPGA	Other	Ball	2912	BGA	Square	Plastic/Epoxy	2800000	Yes		350000		296		Grid Array	BGA2912,54X54,40		1 mm	100 °C (212 °F)	350000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B2912	3.881 mm	55 mm		e1	296	55 mm
10CL080YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.25 V	5079		289	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.4 mm	23 mm			289	23 mm
EP2AGX45DF25C6G	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9	Grid Array, Heat Sink/Slug	BGA572,24X24,40	.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572	2.15 mm	25 mm			260	25 mm
EP2AGX65DF29C6G	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780	2.6 mm	29 mm			372	29 mm
10CL120YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	119088	Yes	1.25 V	7443		277	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)	7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.4 mm	23 mm			277	23 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	100 °C (212 °F)	2700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply		488	29 mm
EP2AGX125EF29C4G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	4964 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780	2.6 mm	29 mm			372	29 mm
EP2AGX45DF25I5G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9	Grid Array, Heat Sink/Slug	BGA572,24X24,40	.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B572	2.15 mm	25 mm			260	25 mm
EP2AGX125EF29I5G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	100 °C (212 °F)	4964 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780	2.6 mm	29 mm			372	29 mm
EP2AGX190FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	7612 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	2.55 mm	35 mm			612	35 mm
EP2AGX260FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	10260 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	2.55 mm	35 mm			612	35 mm
EP2AGX95EF35C4G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	3747 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	2.55 mm	35 mm			612	35 mm
EP2AGX45DF25C4G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9	Grid Array, Heat Sink/Slug	BGA572,24X24,40	.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572	2.15 mm	25 mm			260	25 mm
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	378000	Yes	.88 V	47250		430	0.85	Grid Array	BGA1152,34X34,40	.82 V	1 mm	100 °C (212 °F)	47250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	3.706 mm	35 mm			430	35 mm
1SG085HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	841000	Yes		105125		704		Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)	105125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760	3.881 mm	42.5 mm			704	42.5 mm
5AGZME1E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		342	0.85	Grid Array	BGA780,28X28,40	.82 V	1 mm	85 °C (185 °F)	8302 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780	3.5 mm	33 mm			342	33 mm
5AGZME3E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85	Grid Array	BGA780,28X28,40	.82 V	1 mm	85 °C (185 °F)	13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780	3.5 mm	33 mm			342	33 mm
1SG280LN2F43E2VGAS	Intel	FPGA
10AX032H2F35E1HG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes		11990	TSMC	384		Grid Array	BGA1152,34X34,40		1 mm	100 °C (212 °F)	11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	3.35 mm	35 mm			384	35 mm
EP4SGX530KH40I4G	Intel	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248			0.9	Grid Array	BGA1517,39X39,40	.87 V	1 mm	100 °C (212 °F)	21248 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517	3.4 mm	42.5 mm				42.5 mm
EP4SGX70DF29C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9	Grid Array	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	2904 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780	3.3 mm	29 mm			372	29 mm
EP4SGX360FF35C4G	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144		564	0.9	Grid Array	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	14144 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152	3.3 mm	35 mm			564	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.