Intel Field Programmable Gate Arrays (FPGA) 193

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Thin Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10CL016YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Thin Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10CL016YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL016YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL016YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL016YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL016YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL016YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL016ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340	1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm	-40 to 125 °C range is available as extended industrial			340		23 mm
10CL016ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			340		19 mm
10CL025YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	125 °C (257 °F)	1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL025YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL025YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL025YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch		1.15 V	.5 mm	100 °C (212 °F)	1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						20 mm
10CL025YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	24624	Yes	1.03 V	1539		150	1	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	.97 V	.5 mm	100 °C (212 °F)	1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	-40 to 125 °C range is available as extended industrial			150		20 mm
10CL025ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.03 V	1539		150	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)	1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial			150		14 mm
10CL040YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL040YF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL040YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL040YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm		e1	30 s		260 °C (500 °F)	19 mm
10CL040YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL040YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL040ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325	1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm	-40 to 125 °C range is available as extended industrial			325		23 mm
10CL040ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			325		19 mm
10CL055YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL055YF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL055YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						23 mm
10CL055YU484A7G	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491		321	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			321		19 mm
10CL080YF780C6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm						29 mm
10CL080YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm						29 mm
10CL080YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm						29 mm
10CL080ZF780I8G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1	Grid Array	BGA780,28X28,40	.97 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm	-40 to 125 °C range is available as extended industrial			423		29 mm
10CL120YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	7443 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm						29 mm
10CL120YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm						29 mm
5AGXMB1G4F35I5G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	136880	TSMC	704	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	136880 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm				704		35 mm
10AX066N1F40I1HG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588		Grid Array	BGA1517,39X39,40		1 mm	100 °C (212 °F)	25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm				588		40 mm
10CL080YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes		5079			1.2	Grid Array, Fine Pitch			.8 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.2 mm	19 mm						19 mm
EP2AGX45CU17I5G	Intel	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	.9	Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32	.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B358		1.7 mm	17 mm				156		17 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9	Grid Array	BGA1152,34X34,40	.87 V	1 mm	100 °C (212 °F)	9120 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm				564		35 mm
5AGXFB3H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688	TSMC	704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm				704		35 mm
5AGXBA1D4F27C4G	Intel	FPGA	Other	Ball	672	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830	TSMC	416	1.1	Grid Array, Heat Sink/Slug	BGA672,26X26,40	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		2.7 mm	27 mm				416		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.