SQUARE Network Interfaces 345

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
2746977	Phoenix Contact		INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		1	40 mA	5 V	5	FLATPACK	QFP44,.47SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQFP-G44				Not Qualified
2746980	Phoenix Contact		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		1	40 mA	5 V	5	FLATPACK	TQFP64,.63SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQFP-G64				Not Qualified
KSZ8051RNLUTR	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N32		.9 mm	5 mm	Not Qualified				5 mm
UPD60510F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES						3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified	e6
MC-10287F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES						3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified	e6
NTS0101GS,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.35 mm	1 mm		e3	30	260	1 mm
MCP2021A-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
KSZ8031RNLI-TR	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N24	2	.9 mm	4 mm		e4	40	260	4 mm
MCP2021-330E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	4 mm		e3		260	4 mm
MCP2025T-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
DP83848MPHPREP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G48	4	1.2 mm	7 mm		e4	30	260	7 mm
TLK10034AAJ	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		4	1249 mA	1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B324	4	3.29 mm	19 mm		e1	30	260	19 mm
BCM5388KPB	Broadcom	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY							BOTTOM		S-PBGA-B324						NOT SPECIFIED	NOT SPECIFIED
TLK106LRHBR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1			4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2				e4	NOT SPECIFIED	260
TLK106LRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1			4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2				e4	NOT SPECIFIED	260
TLK111PTR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			4		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-PQFP-G48	1	1.6 mm	7 mm		e4	30	260	7 mm
88E1512-A0-NNP2I000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1			1		3.3 V		CHIP CARRIER	LCC56(UNSPEC)					Tin (Sn)	QUAD	1000 Mbps	S-XQCC-N56					e3
DP83849CVSX/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		4		3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm		e4	30	260	12 mm
DP83910AV/63SN	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			4		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-J28	2A	4.57 mm	11.43 mm		e3	30	245	11.43 mm
TMS38054PAH	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	GULL WING	52	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				200 mA	5 V		FLATPACK, THIN PROFILE			.65 mm	70 Cel	0 Cel		QUAD		S-PQFP-G52		1.2 mm	10 mm	Not Qualified				10 mm
TMS38054FNL	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			1	.2 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	16 Mbps	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	16.5862 mm
TI380C60APAHR	Texas Instruments	TOKEN RING TRANSCEIVER		GULL WING	52	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		FLATPACK, THIN PROFILE			.65 mm				QUAD		S-PQFP-G52		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
TMS38054PBGL	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD		S-PQFP-G52		1.2 mm	10 mm	Not Qualified				10 mm
TLK1211RCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.113 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
DS33Z11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified				14 mm
DS33ZH11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100			10 mm	Not Qualified	e1		225	10 mm
TLK1221RHAT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.113 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
TLK1221RHARG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.113 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1300 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
TLK1221RHATG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.113 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
ATA6624-PGQW	Atmel	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		1 mm	5 mm	Not Qualified				5 mm
PN5331B3HN/C270,51	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
KS8001LI	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1.8 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
MAX4890EETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4890EETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
PX1012A-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1:557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011B-EL1/N,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
MCP2561FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
KSZ8041NLAM	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32	2	.9 mm	5 mm	Not Qualified	e4	40	260	5 mm
TLK2211RCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.23 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
TLK2211RCPR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.23 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
KSZ8051MLL	Micrel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1		1.2 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.