SQUARE Network Interfaces 345

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3980UGH	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.28SQ,20	Analog Transmission Interfaces	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N44	3	.8 mm	7 mm	Not Qualified		e0			7 mm
TLK3114SAGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
CYP15G0101DXB-BBI	Cypress Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		1		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e0			11 mm
TLK2208GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	1300 Mbps	S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SBGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
TLK3104SCGNT	Texas Instruments	ETHERNET TRANSCEIVER	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V		GRID ARRAY			1 mm	75 Cel	-40 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified		e1	30	260	3.6 mm
MAX2829ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
TNETE2201BPJWG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.63SQ,32	Network Interfaces	.5 mm	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
TNETE2201BPJWRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.55SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2201BIRCPR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2201BRCPR	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TNETE2201BPJDRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	30	260	10 mm
MAX4890ETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e0		245	5 mm
TLK1201AIRCPG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.09 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2201BIRCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
DLKPC192SGNT	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,2.5,3.3	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified					19 mm
HI-1575PQI	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2	500 mA	3.3 V		FLATPACK, THIN PROFILE	TQFP32,.35SQ,32		.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G32	3	1.2 mm	7 mm	Not Qualified		e0	30	240	7 mm
E-STE100P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
TLK2201BRCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
KSZ8051MNLU-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
KSZ8051RNLU-TR-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
MC33FS6502CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS6523CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4500NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4501CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4501NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4502CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4502NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4503CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC35FS4503NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
XA1243FPBGABL	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B161		1.17 mm	10.4 mm						10.4 mm
VSC8486YJB-11	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1		1.2 V		GRID ARRAY, LOW PROFILE	BGA144,12X12,40		1 mm	85 Cel	-40 Cel		BOTTOM	.00001 Mbps	S-PBGA-B144		1.4 mm	13 mm						13 mm
VSC8504XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8552XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8562XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8572XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8575XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
BCM53101PIMLG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	132	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N132	3	.9 mm	10 mm						10 mm
BCM53128IQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-45 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
BCM53128KQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
BCM53118KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm						28 mm
BCM53128VKQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		7		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		ALSO REQUIRE 3.3V SUPPLY				28 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.