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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM53106SKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
BCM53134PKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
DP83848MPTBREP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm		e4	30	260	7 mm
DP83848MPTBEP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm		e4	30	260	7 mm
BCM53112MB0ILFBG	Broadcom	SUPPORT CIRCUIT	INDUSTRIAL	UNSPECIFIED			SQUARE		UNSPECIFIED		1										85 Cel	-40 Cel
ATA663231-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
TLE9271QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	10 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9272QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9271QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
ADIN1200CCP32Z-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e3		260	5 mm
ADIN1300CCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE		UNSPECIFIED	YES	1						1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm		e3	30	260	6 mm
ATA663254-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
ATA6560-GBQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
KSZ8842-16MVLI-TR	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1						1.2 V	FLATPACK, LOW PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.6 mm	14 mm		e3			14 mm
TUSB2E22YCGR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE		PLASTIC/EPOXY	YES	1	2					1.8 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm			30	260	2 mm
KSZ8041NLJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1		CMOS	TS 16949			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	2	.9 mm	5 mm		e4	30	260	5 mm
KSZ8051MLLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1				1		3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm		e3	30	260	7 mm
KSZ8051MNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm		e4			5 mm
KSZ8051RNLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm					5 mm
VSC8489YJU-13	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE		PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY, LOW PROFILE		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
DP83826IRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1				1	53 mA	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	1	1 mm	5 mm		e4	30	260	5 mm
KSZ9021GN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-XQCC-N64	3	.9 mm	8 mm		e4	30	260	8 mm
DP83TG720RWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	4	250 mA	1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm	IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
BCM8727CIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES					1		1 V							BOTTOM		S-PBGA-B324
BCM8727BIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES					1		1 V							BOTTOM		S-PBGA-B324	3						260
BCM88470CB0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	1365		SQUARE		PLASTIC/EPOXY	YES	1								BGA1365(UNSPEC)					BOTTOM		S-PBGA-B1365	4						245
BCM8724BIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES	1				1		1.2 V							BOTTOM	10312.5 Mbps	S-PBGA-B324
DP83561HBE/EM	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	FLAT	64	HQFP	SQUARE	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	1				1		1.1 V	FLATPACK, HEAT SINK/SLUG	QFL64,.43SQ,20	.5 mm	125 Cel	-55 Cel	NICKEL GOLD	QUAD	1000000 Mbps	S-CQFP-F64	1	3.53 mm	10.9 mm		e4			10.9 mm
BCM54220SB0IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	144		SQUARE		PLASTIC/EPOXY	YES	1		CMOS		2		1 V							BOTTOM		S-PBGA-B144	3			also operates with 3.3v nom supply			260
MC33FS6517CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6528CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4507LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6505CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6505KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6515NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6516NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.