SQUARE Network Interfaces 345

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
BCM53242MIPBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		24	1450 mA	1.2 V	GRID ARRAY	BGA400,20X20,50	1.27 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PBGA-B400		2.33 mm	27 mm					27 mm
BCM53242MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		24	1450 mA	1.2 V	GRID ARRAY	BGA400,20X20,50	1.27 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PBGA-B400	3	2.33 mm	27 mm					27 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1				1				BGA186(UNSPEC)					BOTTOM		S-PBGA-B186	3
KSZ9131MNXC-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
KSZ9131MNXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
KSZ9131MNXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
TUSB2E22YCGT	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm			30	260	2 mm
TJA1028TK/3V3/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1028TK/5V0/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1028TK/5V0/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
ATA6566-GBQW0-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm					3 mm
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm					3 mm
ATA6563-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100;AEC-Q006	1	85 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm					3 mm
ADIN2299BBCZ	Analog Devices	ETHERNET TRANSCEIVER		BALL	194	BGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	GRID ARRAY	BGA194,17X17,87	2.2 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B194		3.56 mm	38 mm			NOT SPECIFIED	NOT SPECIFIED	38 mm
LAN8820-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm		e3			8 mm
LAN8820I-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm		e3			8 mm
TLK10031CTR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	700 mA	1 V	GRID ARRAY	BGA144,12X12,40	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10312.5 Mbps	S-PBGA-B144	4	3.25 mm	13 mm	Not Qualified	e1	30	260	13 mm
DP83848LFQSQE	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100	4		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
DP83848LFQSQ	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
L6362A	STMicroelectronics	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.45 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N12		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
MCP2003B-E/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
MCP2003BT-H/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
NTS0101GF,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	SMALL OUTLINE, VERY THIN PROFILE		.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.5 mm	1 mm		e3	30	260	1 mm
MCP2542WFDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3	30	260	3 mm
MCP2557FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3			3 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm					5 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
ATA663231-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
ATA663254-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
ATA663255-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
KSZ9897STXC	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949			1.2 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.2 mm	14 mm		e3			14 mm
CC3120RNMARGKR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
CC3120RNMARGKT	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
ATA6562-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	85 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
ATA6566-GBQW1	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
KSZ9031RNXUA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm					7 mm
KSZ9031RNXUB-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48		1 mm	7 mm		e3			7 mm
KSZ9031RNXUB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48		1 mm	7 mm		e3			7 mm
KSZ9031RNXVA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm					7 mm
KSZ9031RNXVB-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48	3	1 mm	7 mm		e3	30	260	7 mm
KSZ9031RNXVB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48	3	1 mm	7 mm		e3		260	7 mm
TCAN1042HDRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
TCAN1042HGDRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
TCAN1042HGDRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.