FBGA Other Function uPs,uCs & Peripheral ICs 227

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
TDA8026ET/C2,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM							30	260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified	e1
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM								260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified
TDA8026ET/C2,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM								260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM							30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PBGA-B49	3	Not Qualified	e1
MCIMX535DVV1B	Freescale Semiconductor	SYSTEM ON CHIP		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS		1.25 V			.8 mm		S-PBGA-B529	3	Not Qualified	e2
TMS320DM6467CCUT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CGUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			20	220	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e0
TMS320DM6467TCUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TCUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TCUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS32DM6467CCUTAV6	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTV6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM													Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B256		Not Qualified
LH7A404N0E000B0A	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM													Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B324		Not Qualified
TMS320DM6467ZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM6467ZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
LS1088ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS		1.025 V			.8 mm		S-PBGA-B780	3		e1
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6QP7CVT8AB	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6DP4AVT8AAR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3
MCIMX6DP4AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3
MCIMX6DP6AVT8AAR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.