FBGA Other Function uPs,uCs & Peripheral ICs 227

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
LS1084ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084ASN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1084AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MCIMX6D4AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6D4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6D5EYM10AER	NXP Semiconductors	SoC	OTHER	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm				30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3		e1
MIMX8DX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C(2), SPI(4), UART(3),	.65 mm	S-PBGA-B367	3		e1
MIMX8DX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
MIMX8DX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8DX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
MIMX8QX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8QX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
MIMX8QX5AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3		e2
MIMX8DX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8QX1AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm				40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
MIMX8DX1AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm				40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm				40	260	19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529	3		e2
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm						19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529
DRA829VMTGBALFRQ1	Texas Instruments	SoC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	24 mm					250	24 mm	CMOS	.8 V		.8 mm	S-PBGA-B827	3	2000 rpm	e1
LS1023AXE7QQB	NXP Semiconductors	SoC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA621,25X25,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	1 V		.8 mm	S-PBGA-B621	3
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V		.8 mm	S-PBGA-B784
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V		.8 mm	S-PBGA-B784

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.