FBGA Other Function uPs,uCs & Peripheral ICs 227

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm	CMOS	1 V	.8 mm	S-PBGA-B784
MPFS250TFCVG484E	Microchip Technology	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS250TFCVG484I	Microchip Technology	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS250TS-1FCVG484I	Microchip Technology	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel	BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
AM6421BSFGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6441BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSFGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6411BKCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6412BSCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6441BSEFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSDGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6442BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6411BSCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6421BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6442BSEGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441		1000 rpm
AM6422BSDGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
P1025NXE5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA561,27X27,32		125 Cel	-40 Cel	BOTTOM	2.3 mm	23 mm				23 mm	CMOS		.8 mm	S-PBGA-B561	3
TDA4VE88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	2000 rpm
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	2000 rpm
TDA4VL21HGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	1200 rpm
DRA821U4TCBALMRQ1	Texas Instruments	SoC	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	17.2 mm			250	17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433	3	2000 rpm
DRA821U4TCBALMQ1	Texas Instruments	SoC	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	17.2 mm			250	17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433	3	2000 rpm
P1025NSE5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel	BOTTOM	2.3 mm	23 mm				23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3
P1015NSN5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel	BOTTOM	1.79 mm	23 mm		40	260	23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3
AM62A74AUMHAAMBR	Texas Instruments	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.556 mm	18 mm				18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel	BOTTOM	2.556 mm	18 mm				18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM68A92ATGGHAALZR	Texas Instruments	SoC	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm		30	260	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3
XAM69A98ATNGHAALY	Texas Instruments	SoC	BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel	BOTTOM	3.341 mm	31 mm				31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.