FBGA Other Function uPs,uCs & Peripheral ICs 227

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
MCIMX6DP6AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
66AK2L06XCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMS	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
MCIMX6DP4AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6DP6AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1176 rpm	e1
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1176 rpm	e1
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	48	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1000 rpm	e1
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm	64	32 MHz	30	250	23 mm	CMOS	1.15 V	CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3	1500 rpm	e1
AM5716AABCDA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCDEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCD	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3	1500 rpm	e1
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3	1500 rpm	e1
XCZU2CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU2EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU3CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU3EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU4CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3		e1
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU2EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU3EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3		e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4		e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.