FBGA Other Function uPs,uCs & Peripheral ICs 227

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4		e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4		e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V	.8 mm	S-PBGA-B784	4		e1
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V	.8 mm	S-PBGA-B760	3		e1
AM5716AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V	.8 mm	S-PBGA-B760	3		e1
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V	.8 mm	S-PBGA-B760	3	1500 rpm	e1
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V	.8 mm	S-PBGA-B760	3	1500 rpm	e1
MCIMX6DP4AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3		e1
MCIMX6DP6AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT08AE	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
LS1043AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3		e1
LS1023AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3		e1
LS1043AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3		e1
LS1023AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	1 V	.8 mm	S-PBGA-B621	3		e1
LS1043AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3		e1
LS1023AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3		e1
LS1023AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	1 V	.8 mm	S-PBGA-B621	3		e1
LS1043AXE7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3		e1
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3		e1
LS1088ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1044ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044ASN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1044AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3
LS1048ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048ASN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1048AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1084ASE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1084ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1084ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1
LS1084ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V	.8 mm	S-PBGA-B780	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.