| Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Total Dose (V) | Maximum Supply Voltage | No. of Functions | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
22 |
PHEMT |
1 |
50 mA |
COMPONENT |
3 |
DIE OR CHIP |
50 ohm |
85 Cel |
19.5 dB |
-55 Cel |
71000 MHz |
86000 MHz |
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|
|
Analog Devices |
NARROW BAND LOW POWER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
PHEMT |
1 |
10 dBm |
65 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
12.5 dB |
-40 Cel |
MATTE TIN |
e3 |
1200 MHz |
2200 MHz |
|||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
1 |
25 dBm |
7 |
430 mA |
COMPONENT |
10 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12 dB |
-40 Cel |
200 MHz |
22000 MHz |
|||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
32 |
GAAS |
1 |
25 dBm |
7 |
COMPONENT |
12 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12.5 dB |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
e4 |
0 MHz |
7500 MHz |
||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
32 |
GAAS |
1 |
25 dBm |
7 |
COMPONENT |
12 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12.5 dB |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
e4 |
0 MHz |
7500 MHz |
||||||||
|
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
HYBRID |
1 |
30 dBm |
415 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
23.5 dB |
TIN |
e3 |
1500 MHz |
2700 MHz |
|||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
TIN |
e3 |
2400 MHz |
3100 MHz |
||||||||
|
|
NXP Semiconductors |
NARROW BAND LOW POWER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
HYBRID |
1 |
30 dBm |
1.58 |
1200 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
36.3 dB |
TIN |
e3 |
3400 MHz |
3800 MHz |
||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
16.5 dB |
-40 Cel |
10 MHz |
1100 MHz |
||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
16.5 dB |
-40 Cel |
10 MHz |
1100 MHz |
||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
10 MHz |
2800 MHz |
||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
33 dBm |
6 |
100 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
10 MHz |
2800 MHz |
||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
3200 MHz |
4000 MHz |
||||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
TIN |
e3 |
3200 MHz |
4000 MHz |
||||||||
|
|
NXP Semiconductors |
WIDE BAND LOW POWER |
SURFACE MOUNT |
10 |
PLASTIC/EPOXY |
IEC-60134 |
1 |
20 dBm |
1.43 |
85 mA |
COMPONENT |
5 |
SOLCC10,.12SQ,20 |
50 ohm |
NICKEL PALLADIUM GOLD |
e4 |
1500 MHz |
2700 MHz |
|||||||||
|
|
NXP Semiconductors |
WIDE BAND LOW POWER |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
1 |
20 dBm |
1.07 |
60 mA |
COMPONENT |
5 |
SOLCC8,.08,20 |
50 ohm |
85 Cel |
17 dB |
-40 Cel |
300 MHz |
1500 MHz |
|||||||||
|
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
TIN |
e3 |
575 MHz |
960 MHz |
||||||||
|
|
Wolfspeed |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
6 |
CERAMIC |
PHEMT |
1 |
3 |
1000 mA |
COMPONENT |
28 |
50 ohm |
105 Cel |
31 dB |
-40 Cel |
5200 MHz |
5900 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAN |
1 |
18 dBm |
6 |
150 mA |
COMPONENT |
28 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
31 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
2700 MHz |
3800 MHz |
||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
COMPONENT |
2.15/28 |
50 ohm |
150 Cel |
28 dB |
-40 Cel |
TIN |
e3 |
1800 MHz |
2200 MHz |
|||||||||
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
8 |
GAAS |
1 |
1.08 |
COMPONENT |
10 |
DIE OR CHIP |
50 ohm |
9.5 dB |
0 MHz |
48000 MHz |
||||||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
10 |
PHEMT |
1 |
18 dBm |
1400 mA |
COMPONENT |
5 |
DIE OR CHIP |
50 ohm |
85 Cel |
18 dB |
-55 Cel |
18000 MHz |
44000 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
16 |
CERAMIC, METAL-SEALED COFIRED |
GAAS |
1 |
20 dBm |
COMPONENT |
5 |
50 ohm |
85 Cel |
20 dB |
-40 Cel |
18000 MHz |
44000 MHz |
|||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
16 |
CERAMIC, METAL-SEALED COFIRED |
GAAS |
1 |
20 dBm |
COMPONENT |
5 |
50 ohm |
85 Cel |
20 dB |
-40 Cel |
18000 MHz |
44000 MHz |
|||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
18 |
CERAMIC, METAL-SEALED COFIRED |
GAAS |
1 |
27 dBm |
1.29 |
COMPONENT |
5 |
50 ohm |
85 Cel |
18.5 dB |
-40 Cel |
20000 MHz |
44000 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
18 |
CERAMIC, METAL-SEALED COFIRED |
GAAS |
1 |
27 dBm |
1.29 |
COMPONENT |
5 |
50 ohm |
85 Cel |
18.5 dB |
-40 Cel |
20000 MHz |
44000 MHz |
||||||||||
|
|
M/a-com Technology Solutions |
WIDE BAND LOW POWER |
SURFACE MOUNT |
8 |
1 |
24 dBm |
1.67 |
75 mA |
COMPONENT |
5 |
DIE OR CHIP |
50 ohm |
85 Cel |
18 dB |
-40 Cel |
30 MHz |
8000 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
16 |
PHEMT |
1 |
25 dBm |
1.58 |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
10 dB |
-40 Cel |
400 MHz |
7500 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
16 |
PHEMT |
1 |
25 dBm |
1.58 |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
85 Cel |
10 dB |
-40 Cel |
400 MHz |
7500 MHz |
||||||||||
|
|
Analog Devices |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
32 |
GAN |
1 |
30 dBm |
1.5 |
COMPONENT |
50 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
30.5 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
900 MHz |
1600 MHz |
||||||||
|
|
Analog Devices |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
32 |
GAN |
1 |
30 dBm |
1.5 |
COMPONENT |
50 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
30.5 dB |
-40 Cel |
NICKEL PALLADIUM GOLD |
e4 |
900 MHz |
1600 MHz |
||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
28 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
27.1 dB |
3700 MHz |
4000 MHz |
||||||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
30 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
29.3 dB |
NICKEL PALLADIUM GOLD |
e4 |
3400 MHz |
3700 MHz |
||||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
26 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
26.5 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3700 MHz |
|||||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
26 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
26.1 dB |
NICKEL PALLADIUM GOLD |
I/P POWER-MAX (PEAK)=25DBM |
e4 |
3600 MHz |
3800 MHz |
|||||||||
|
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
PHEMT |
1 |
22 dBm |
1.49 |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
17 dB |
-40 Cel |
10 MHz |
26500 MHz |
|||||||||
|
|
M/a-com Technology Solutions |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
8 |
1 |
10 dBm |
1.58 |
140 mA |
COMPONENT |
5 |
DIE OR CHIP |
50 ohm |
85 Cel |
16.5 dB |
-40 Cel |
5000 MHz |
20000 MHz |
||||||||||
|
|
Analog Devices |
WIDE BAND LOW POWER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
PHEMT |
1 |
20 dBm |
1.43 |
100 mA |
COMPONENT |
3/5 |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
11 dB |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
4800 MHz |
6000 MHz |
||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
28 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
32 dB |
I/P POWER-MAX (PEAK)=25DBM |
2300 MHz |
2400 MHz |
|||||||||||
|
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
1 |
25 dBm |
1.38 |
300 mA |
COMPONENT |
3.3 |
LCC12,.08SQ,20 |
50 ohm |
125 Cel |
30 dB |
2300 MHz |
4200 MHz |
||||||||||
|
Renesas Electronics |
WIDE BAND LOW POWER |
SURFACE MOUNT |
12 |
1 |
20 dBm |
1.1 |
86 mA |
COMPONENT |
3.3/5 |
LCC12,.08SQ,20 |
100 ohm |
115 Cel |
18 dB |
-40 Cel |
LOW NOISE |
3000 MHz |
4200 MHz |
||||||||||
|
|
Renesas Electronics |
WIDE BAND LOW POWER |
SURFACE MOUNT |
23 |
PLASTIC/EPOXY |
2 |
0 dBm |
2 |
COMPONENT |
0.95 |
BGA23,5X5,20 |
50 ohm |
85 Cel |
19.5 dB |
-40 Cel |
TIN |
e3 |
17700 MHz |
21200 MHz |
||||||||
|
Renesas Electronics |
WIDE BAND LOW POWER |
SURFACE MOUNT |
23 |
PLASTIC/EPOXY |
2 |
0 dBm |
2 |
COMPONENT |
0.95 |
BGA23,5X5,20 |
50 ohm |
85 Cel |
19.5 dB |
-40 Cel |
TIN |
e3 |
17700 MHz |
21200 MHz |
|||||||||
|
|
Renesas Electronics |
WIDE BAND LOW POWER |
SURFACE MOUNT |
23 |
PLASTIC/EPOXY |
2 |
0 dBm |
2 |
COMPONENT |
0.95 |
BGA23,5X5,20 |
50 ohm |
85 Cel |
19.5 dB |
-40 Cel |
TIN |
e3 |
14000 MHz |
17000 MHz |
||||||||
|
Renesas Electronics |
WIDE BAND LOW POWER |
SURFACE MOUNT |
23 |
PLASTIC/EPOXY |
2 |
0 dBm |
2 |
COMPONENT |
0.95 |
BGA23,5X5,20 |
50 ohm |
85 Cel |
19.5 dB |
-40 Cel |
TIN |
e3 |
14000 MHz |
17000 MHz |
|||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
40 |
GAN |
1 |
31 dBm |
1.54 |
COMPONENT |
LCC40,.24SQ,20 |
50 ohm |
85 Cel |
27 dB |
-40 Cel |
4800 MHz |
6000 MHz |
|||||||||||
|
|
Analog Devices |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
40 |
GAN |
1 |
31 dBm |
1.54 |
COMPONENT |
LCC40,.24SQ,20 |
50 ohm |
85 Cel |
27 dB |
-40 Cel |
4800 MHz |
6000 MHz |
|||||||||||
|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
27 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
25.6 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3580 MHz |
RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.
The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.
RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.