Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1042T/1U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1042T/3/1U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1049T,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	65 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		30	260	4.9 mm
TJA1051T/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1051T/3/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1054AT/M,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1054T/N1M,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UJA1061TW/3V3/C/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm				260	11 mm
UJA1061TW/5V0/C/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm				260	11 mm
UJA1065TW/5V0/C/T	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm			30	260	11 mm
UJA1066TW/3V3/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm		e4	30	260	11 mm
UJA1066TW/5V0/T,51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm				260	11 mm
UJA1066TW/5V0/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm		e4	30	260	11 mm
UJA1069TW24/5V0/C:	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G24	3	1.1 mm	6.1 mm				260	11 mm
LAN8820-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm		e3			8 mm
LAN8820I-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm		e3			8 mm
TLK10031CTR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	700 mA	1 V		GRID ARRAY	BGA144,12X12,40		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10312.5 Mbps	S-PBGA-B144	4	3.25 mm	13 mm	Not Qualified	e1	30	260	13 mm
DP83848LFQSQE	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100	4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
DP83848LFQSQ	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
L6362A	STMicroelectronics	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						24 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.45 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N12		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
MCP2003B-E/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
MCP2003BT-H/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
TJA1081BTS,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	60 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	Network Interfaces	.65 mm	125 Cel	-40 Cel		DUAL	10 Mbps	R-PDSO-G16	1	2 mm	5.3 mm	Not Qualified		30	260	6.2 mm
TCAN332GDCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm		e4	30	260	2.9 mm
RN131G-I/RM	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	37 mm
NTS0101GF,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.5 mm	1 mm		e3	30	260	1 mm
NTS0101GM,115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm		e3	30	260	1.45 mm
NTS0101GW,125	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G6	1	1.1 mm	1.25 mm		e3	30	260	2 mm
TJF1051T/3/1U	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TJF1051T/3/CM,118	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		30	260	4.9 mm
TCAN330DCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm		e4	30	260	2.9 mm
TCAN330GDCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm		e4	30	260	2.9 mm
TCAN334D	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TCAN337D	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TCAN1042HGVDQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	30	260	4.905 mm
TCAN1042VDQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	30	260	4.905 mm
MCP2542WFDT-E/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2542WFDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3	30	260	3 mm
MCP2542WFDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2544FDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
MCP2544WFDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2557FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3			3 mm
MCP2557FDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
TCAN1051HVDQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	NOT SPECIFIED	260	4.905 mm
TCAN1051VDQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	NOT SPECIFIED	260	4.905 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm					5 mm
RN131G-I/RM475	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	37 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.