Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM5348MA1KPBG	Broadcom	ETHERNET TRANSCEIVER		BALL	676		RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		24									BOTTOM		R-PBGA-B676
TLIN10285DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	6.1 V	SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TCAN1146DMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	120 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	S-PDSO-N14	2	1 mm	3 mm		e4	30	260	4.5 mm
UJA1169ATK/F/3	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR		PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
BCM53101EIMLG	Broadcom	ETHERNET TRANSCEIVER					UNSPECIFIED		UNSPECIFIED		1						1.2 V							UNSPECIFIED			3						260
DP83TG720RWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	4	250 mA	1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm	IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
BCM54185B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		8			GRID ARRAY			70 Cel	0 Cel		BOTTOM		R-PBGA-B400
BCM54180B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		8			GRID ARRAY			70 Cel	0 Cel		BOTTOM		R-PBGA-B400
BCM54182B0KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	128	QCCN	RECTANGULAR		UNSPECIFIED	YES	1		CMOS		8			CHIP CARRIER			70 Cel	0 Cel		QUAD		R-XQCC-N128
BCM54180B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		8			GRID ARRAY			85 Cel	-40 Cel		BOTTOM		R-PBGA-B400	3						260
BCM8727CIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES					1		1 V							BOTTOM		S-PBGA-B324
BCM8727BIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES					1		1 V							BOTTOM		S-PBGA-B324	3						260
BCM88470CB0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	1365		SQUARE		PLASTIC/EPOXY	YES	1								BGA1365(UNSPEC)					BOTTOM		S-PBGA-B1365	4						245
BCM5488SA7IPBG	Broadcom	ETHERNET TRANSCEIVER		BALL	484		RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		1									BOTTOM	1000 Mbps	R-PBGA-B484
BCM8724BIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE		PLASTIC/EPOXY	YES	1				1		1.2 V							BOTTOM	10312.5 Mbps	S-PBGA-B324
BCM56450B1IFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED		UNSPECIFIED		1		CMOS											UNSPECIFIED	102500 Mbps	X-XXSS-X	4						245
BCM88370CB0KFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED		UNSPECIFIED		1													UNSPECIFIED	800000 Mbps	X-XXSS-X	4						245
DP83561HBE/EM	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	FLAT	64	HQFP	SQUARE	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	1				1		1.1 V	FLATPACK, HEAT SINK/SLUG	QFL64,.43SQ,20	.5 mm	125 Cel	-55 Cel	NICKEL GOLD	QUAD	1000000 Mbps	S-CQFP-F64	1	3.53 mm	10.9 mm		e4			10.9 mm
BCM54220SB0IQLEG	Broadcom	ETHERNET TRANSCEIVER		UNSPECIFIED			UNSPECIFIED		UNSPECIFIED		1		CMOS		2		1 V							UNSPECIFIED			3			also operates with 3.3v nom supply			260
BCM54220SB0IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	144		SQUARE		PLASTIC/EPOXY	YES	1		CMOS		2		1 V							BOTTOM		S-PBGA-B144	3			also operates with 3.3v nom supply			260
BCM5248XA4KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	256		RECTANGULAR		PLASTIC/EPOXY	YES	1		CMOS		8		1.8 V		BGA256(UNSPEC)					BOTTOM		R-PBGA-B256	3			Also has 2.5V Supply			260
BCM54210SB0KMLG	Broadcom	ETHERNET TRANSCEIVER									1		CMOS		1										1000 Mbps		3						260
BCM54382C1KFBG	Broadcom	ETHERNET TRANSCEIVER									1		CMOS		8										1000 Mbps		3						260
MC33FS6517CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6528CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4507LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6505CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6505KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6515NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6516NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6518NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	2			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.