Network Interfaces

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8504XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	900 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm	e1			17 mm
VSC8512XJG-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				12		1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC8514XMK-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4	605 mA	1 V	CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25	.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBCC-N138		.85 mm	12 mm				12 mm
VSC8552XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY		1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8562XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	1130 mA	2.5 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm		NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8564XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8572XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	800 mA	2.5 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8574XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	980 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8575XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8584XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	2.5 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1.2 V	GRID ARRAY	BGA256,16X16,40	1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm				17 mm
BCM53101PKMLG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	132	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N132	3	.9 mm	10 mm				10 mm
BCM53134MKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm				11 mm
BCM53158XUB1KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	311	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B311	3	1.337 mm	13 mm	e1			13 mm
BCM53106OKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm				11 mm
BCM53106SKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm				11 mm
BCM53134PKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY, THIN PROFILE, FINE PITCH		.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm				11 mm
ADM3050ETRWZ-EP	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	2.65 mm	7.5 mm	e4		260	10.3 mm
DP83848MPTBREP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	e4	30	260	7 mm
DP83848MPTBEP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	e4	30	260	7 mm
BCM53112MB0ILFBG	Broadcom	SUPPORT CIRCUIT	INDUSTRIAL	UNSPECIFIED			SQUARE	UNSPECIFIED		1										85 Cel	-40 Cel
BCM5482HA2KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					GRID ARRAY						BOTTOM		R-PBGA-B121
TLIN10285DRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	12 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm	e4	30	260	4.905 mm
TJA1022HGZ	NXP Semiconductors	INTERFACE CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				1			e4	30	260
ATA663231-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm	e3			3 mm
BCM54811A2IMLG	Broadcom	ETHERNET TRANSCEIVER		UNSPECIFIED	48		UNSPECIFIED	UNSPECIFIED		1		CMOS																		NOT SPECIFIED	NOT SPECIFIED
BGS8458Z	NXP Semiconductors	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS				3.6 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6	1	.33 mm	1.2 mm			260	1.4 mm
TLE9271QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	10 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm	e3			7 mm
TLE9272QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm	e3			7 mm
TLE9271QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm	e3			7 mm
ADIN1200CCP32Z-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm	e3		260	5 mm
ADIN1300CCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm	e3	30	260	6 mm
ATA663254-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm	e3			3 mm
ATA6560-GAQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm				4.9 mm
ATA6560-GBQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm				3 mm
KSZ8842-16MVLI-TR	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V	FLATPACK, LOW PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.6 mm	14 mm	e3			14 mm
TUSB2E22YCGR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm		30	260	2 mm
ATA663254-GAQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	e4			4.9 mm
RN131G-I/RM481	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID				3.3 V	MICROELECTRONIC ASSEMBLY		2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm				37 mm
RN171-I/RM475	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID	TS 16949			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm				26.67 mm
RN171-I/RM480	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID	TS 16949			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm				26.67 mm
KSZ8041NLJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	TS 16949			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	2	.9 mm	5 mm	e4	30	260	5 mm
KSZ8051MLLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	e3	30	260	7 mm
KSZ8051MNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm	e4			5 mm
KSZ8051RNLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm				5 mm
VSC8489YJU-13	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY, LOW PROFILE		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm				15 mm
DP83826IRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1	53 mA	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	1	1 mm	5 mm	e4	30	260	5 mm
KSZ9021GN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-XQCC-N64	3	.9 mm	8 mm	e4	30	260	8 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.