Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCAN1043GDQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	5 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm	e4	NOT SPECIFIED	NOT SPECIFIED	8.65 mm
TCAN1043HDMTRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	R-PDSO-N14	2	1 mm	3 mm	e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TCAN1043HDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm	e4	NOT SPECIFIED	NOT SPECIFIED	8.65 mm
TCAN1043HGDMTRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	R-PDSO-N14	2	1 mm	3 mm	e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TCAN1043HGDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	5 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm	e4	NOT SPECIFIED	NOT SPECIFIED	8.65 mm
TLIN2029DRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm	e4	30	260	3 mm
HVD233HKX/EM	Texas Instruments	INTERFACE CIRCUIT		FLAT	8	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	1				6 mA	3.3 V	FLATPACK		1.27 mm			NICKEL GOLD	DUAL	1 Mbps	R-CDFP-F8		2.785 mm	6.475 mm	e4			6.485 mm
TLIN1022DMTRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
TLIN1022DMTTQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
TLIN2022DMTTQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
BCM8073CIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V	GRID ARRAY						BOTTOM		S-PBGA-B324	3					260
TLE7250GXUMA2	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm				DUAL		R-PDSO-G8	2A	1.75 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	5 mm
TLE7263EXUMA2	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V	SMALL OUTLINE, SHRINK PITCH		.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm		NOT SPECIFIED	NOT SPECIFIED	12.8 mm
TLE8250SJXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm			NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm				5 mm
TLE8250VSJXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm			NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm				5 mm
TLE9255WSKXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm				DUAL		R-PDSO-G14		1.75 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	8.75 mm
IFX1051LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3		260	3 mm
IFX1051SJXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm			260	5 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE92613QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	.5 Mbps	S-PQCC-N48		.9 mm	7 mm				7 mm
TLE9261QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm				7 mm
TLE92613BQXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm				7 mm
TLE9261BQXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm				7 mm
BCM5241A1IMLGT	Broadcom	ETHERNET TRANSCEIVER		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						2.5 V	SPECIAL SHAPE					SILVER	UNSPECIFIED		R-XXSS-X	3			e4		260
AX-SFJK-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm	e4		260	7 mm
TLE92603QXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm				7 mm
TLE9261QXXUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48	3	.9 mm	7 mm				7 mm
NCV7429DE5R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	2	1.1 mm	4.4 mm	e3	30	260	6.5 mm
RN2483A-I/RM103	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47		3.34 mm	17.78 mm				26.67 mm
NCV7381BDP0R2G	Onsemi	FLEXRAY TRANSCEIVER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	37 mA	5 V	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	10 Mbps	R-PDSO-G16	3	1.99 mm	5.3 mm	e4	30	260	6.2 mm
MC35FS4500CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
UJA1169TKZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	7.5 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.15,20	.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	2 Mbps	R-PDSO-N20	1	1 mm	3.5 mm	e4	30	260	5.5 mm
TJA1028TK/5V0/20:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm		30	260	3 mm
TJA1083GTT/0Z	NXP Semiconductors	INTERFACE CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				1			e4	30	260
NCV7471BDQ5R2G	Onsemi	CAN FD, LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	AEC-Q100	2		5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.4,20	.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 Mbps	R-PDSO-G36	3	2.65 mm	7.5 mm	e4	30	260	10.3 mm
BCM53134SKFBG	Broadcom	SUPPORT CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY						BOTTOM		S-PBGA-B256	3					260
SKY85337-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		UNSPECIFIED	16		SQUARE	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY						UNSPECIFIED		S-XXMA-X16					NOT SPECIFIED	NOT SPECIFIED
ISO1042BQDWQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	2.65 mm	7.5 mm	e4	30	260	10.3 mm
TLIN14413DMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.1 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e3	30	260	4.5 mm
TLIN14415DMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.1 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e3	30	260	4.5 mm
TLIN24413DMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.1 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e3	30	260	4.5 mm
TLIN24415DMTRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.1 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e3	30	260	4.5 mm
TLIN24415DMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V	SMALL OUTLINE, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.1 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e3	30	260	4.5 mm
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1 V	GRID ARRAY	BGA256,16X16,40	1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm	e1			17 mm
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2	150 mA	1.2 V	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm				15 mm
VSC8501XML	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	135	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1				1	165 mA	1 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SLGA135(UNSPEC)	.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-N135		.85 mm	12 mm				12 mm
VSC8504XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V	GRID ARRAY		1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm				17 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.