Network Interfaces

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
BCM53101PIMLG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	132	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N132	3	.9 mm	10 mm						10 mm
BCM53128IQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-45 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
BCM53128KQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
BCM53118KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm						28 mm
BCM53128VKQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			7		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		ALSO REQUIRE 3.3V SUPPLY				28 mm
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM5325FIQMG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			6	290 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm						20 mm
BCM5325FKQMG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			6	290 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm						20 mm
BCM53242MIPBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PBGA-B400		2.33 mm	27 mm						27 mm
BCM53242MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PBGA-B400	3	2.33 mm	27 mm						27 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1					1					BGA186(UNSPEC)						BOTTOM		S-PBGA-B186	3
ADM3050ETRWZ-EP-RL	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	2.65 mm	7.5 mm			e4		260	10.3 mm
ADM3056EBRIZ-RL	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G20	3	2.64 mm	7.5 mm					260	12.8 mm
ADM3057ETRWZ-EP-RL	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	105 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G20	3	2.65 mm	7.5 mm			e3		260	12.8 mm
KSZ9131MNXC-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ9131MNXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ9131MNXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
TUSB2E22YCGT	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm				30	260	2 mm
BCM54140B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			4				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B256							NOT SPECIFIED	NOT SPECIFIED
BCM54140B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			4				GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B256						e1		255
TCAN1043ADRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	110 mA	5 V		SMALL OUTLINE	SOP14,.25		1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm			e4	30	260	8.65 mm
TJA1028T/3V3/20:11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1028T/5V0/20/1U	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
TJA1028TK/3V3/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028TK/5V0/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028TK/5V0/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
UJA1075ATW/3V3/1J	NXP Semiconductors	ETHERNET TRANSCEIVER																							NICKEL PALLADIUM GOLD SILVER				1					e4	30	260
UJA1075ATW/3V3/WDJ	NXP Semiconductors	ETHERNET TRANSCEIVER																							NICKEL PALLADIUM GOLD SILVER				1					e4	30	260
UJA1075ATW/5V0/1J	NXP Semiconductors	ETHERNET TRANSCEIVER																							NICKEL PALLADIUM GOLD SILVER				1					e4	30	260
SCL3400-D01-004	Murata Manufacturing	WIRELESS LAN CIRCUIT
SCL3400-D01-1	Murata Manufacturing	WIRELESS LAN CIRCUIT
ATA6566-GAQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
ATA6566-GBQW0-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6562-GAQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100;AEC-Q006		1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	4.9 mm						3.9 mm
ATA6563-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100;AEC-Q006		1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ADIN2299BBCZ	Analog Devices	ETHERNET TRANSCEIVER		BALL	194	BGA	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		GRID ARRAY	BGA194,17X17,87		2.2 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B194		3.56 mm	38 mm				NOT SPECIFIED	NOT SPECIFIED	38 mm
TLE9254LCXUMA1	Infineon Technologies	SUPPORT CIRCUIT																							Tin (Sn)				2A					e3	NOT SPECIFIED	NOT SPECIFIED
78Q8392LA03-CHR/F	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		BICMOS		-9 V	1	.065 mA	9 V	+-9	IN-LINE	LDCC28,.5SQ	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T28	3	4.191 mm	10.16 mm	Not Qualified					11.54 mm
TLE6251DSNTMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100				5 V		SMALL OUTLINE			1.27 mm			MATTE TIN	DUAL		R-PDSO-G8		1.75 mm	4 mm			e3			5 mm
TJA1043T/1U	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm					260	8.65 mm
TJA1020T/VM,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1020T/VM,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1040T/H/V,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			1	75 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
TJA1041T/VM,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm						8.65 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.