Other Function uPs,uCs & Peripheral ICs

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

LH7A404N0E000B0A

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

DM355SDZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCEA216

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

TMX320DM355ZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

SM32DM355GCEM216EP

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

1.3 mm

8192

13 mm

32

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

e0

TMS320DM6441AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.05 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

XA7Z010-1CLG225Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

125 Cel

-40 Cel

TIN SILVER COPPER

N

BOTTOM

1.5 mm

13 mm

13 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B225

3

Not Qualified

e1

XA7Z010-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z010-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

125 Cel

-40 Cel

TIN SILVER COPPER

N

BOTTOM

1.6 mm

19 mm

30

260

19 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B484

3

Not Qualified

e1

XA7Z030-1FBG484I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY

BGA484,22X22,40

Tin/Silver/Copper (Sn/Ag/Cu)

N

BOTTOM

2.54 mm

23 mm

30

250

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e1

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY

BGA484,22X22,40

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

N

BOTTOM

2.54 mm

23 mm

30

250

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e1

TMS320DM6446BZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

HTCM400/EAE,122

NXP Semiconductors

OTHER

27

PLASTIC/EPOXY

5

MICROELECTRONIC ASSEMBLY

MODULE,27LEAD,1

85 Cel

-25 Cel

100 mA

5 V

Other uPs/uCs/Peripheral ICs

Not Qualified

P82B715TD,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

12 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

BIPOLAR

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

PCA9504ADGG,112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

PCA9504ADGG,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

TDA8002CG/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP32,.28SQ,20

3 V

85 Cel

-25 Cel

TIN

QUAD

1.6 mm

5 mm

5 mm

CMOS

140 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G32

3

Not Qualified

e3

TDA8002CT/A/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

TDA8002CT/B/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

TDA8002CT/C/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

3

Not Qualified

e4

TDA8002CT/C/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

3

Not Qualified

e4

TDA8007BHL/C2,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

SILVER

QUAD

1.6 mm

7 mm

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e4

TDA8007BHL/C3,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

7 mm

30

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e3

FT245BM

FTDI

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK, LOW PROFILE

4.35 V

70 Cel

0 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

250

7 mm

CMOS

5 V

.8 mm

S-PQFP-G32

3

Not Qualified

e0

R3920-CFAB-E1T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

NO

YES

CHIP CARRIER

LGA25,3X8,27

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NO

4.218 MHz

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

.686 mm

FIXED POINT

R-PBCC-B25

TCI6630K2LCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LSCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LSCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LXCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

MSP430F67491IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

30

260

20 mm

CMOS

3.3 V

.5 mm

R-PQFP-G128

3

e4

MSP430F67491IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

32

14 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

0

30

260

20 mm

32768

CMOS

3.3 V

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.