Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			40	260	5 mm	CMOS	5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4
TMS320DM355ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm	ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY	48	27 MHz	30	260	16 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TIR1000IPWG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm	CMOS	3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000IPWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm	CMOS	3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			SMALL OUTLINE		2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm		5.3 mm	CAN ALSO OPERATE AT 5V SUPPLY			30	260	6.2 mm	CMOS	3 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e4
STA2058EXATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EXA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EXTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm		S-PBGA-B144		Not Qualified
STA2058EX	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		10 mm				30	260	10 mm	CMOS	3.3 V			.8 mm		S-PBGA-B144	3	Not Qualified	e1
STA2058	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		10 mm				30	260	10 mm	CMOS	3.3 V			.5 mm		S-PQFP-G64	3	Not Qualified	e4
STMPE16M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		4 mm				40	260	4 mm	CMOS	1.8 V			.4 mm		S-XQCC-N32	3	Not Qualified	e3
STMPE24M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		5 mm				30	260	5 mm	CMOS	1.8 V			.4 mm		S-XQCC-N40	3	Not Qualified	e3
HCTL-2017	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	16		RECTANGULAR	UNSPECIFIED	NO	5.5 V			MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-40 Cel	MATTE TIN	DUAL								260		CMOS	5 V					R-XDMA-P16		Not Qualified	e3
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.5 mm		3.76 mm					245	3.94 mm	CMOS	3.3 V			1.27 mm		R-PDSO-C6	1	Not Qualified	e0
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel	-40 Cel		QUAD	1 mm		5 mm				40	260	5 mm	CMOS				.5 mm		S-XQCC-N32	3	Not Qualified
LS1088ASE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
LS1088AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm				30	250	23 mm	CMOS	1.025 V			.8 mm		S-PBGA-B780	3		e1
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6DP5EYM1AB	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.			40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm	CMOS				.5 mm		S-PBGA-B272	3
MCIMX6G3CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm	CMOS				.5 mm		S-PBGA-B272	3
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6QP5EYM1AB	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.			40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6QP7CVT8AB	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6S5DVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		e1
MCIMX6S8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		e1
MCIMX6U5DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		e1
MCIMX6U8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		e1
MCIMX6X1CVO08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm	24MHZ NOMINAL FREQUENCY AVAILABLE			40	260	17 mm	CMOS	1.8 V			.8 mm		S-PBGA-B400	3		e1
MCIMX6X3CVK08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		14 mm	24MHZ NOMINAL FREQUENCY AVAILABLE			40	260	14 mm	CMOS	1.8 V			.65 mm		S-PBGA-B400	3		e1
MCIMX6X4CVM08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3		e1
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	.9 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA100E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	1 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	.9 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm		21 mm				30	260	21 mm	CMOS	.9 V			.8 mm		S-PBGA-B625	3		e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.