Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
MSP430F67641AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	12 mm		0		30	260	12 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3		e4
MSP430F67641AIPN	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	12 mm		0		30	260	12 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3		e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	14 mm		0		30	260	14 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		e4
MSP430F67641AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	8	14 mm		0		30	260	14 mm	8192	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		e4
66AK2L06XCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMS	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm		CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
DLPC3439ZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel		-30 Cel			BOTTOM	1 mm		13 mm						13 mm		CMOS	1.1 V		.8 mm	S-PBGA-B201
DLPC410ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V	85 Cel		0 Cel			BOTTOM	3 mm		27 mm				NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS	1 V		1 mm	S-PBGA-B676
UCD3138ARGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	1 mm		9 mm		0	2 MHz	30	260	9 mm		CMOS	3.3 V	I2C; UART	.5 mm	S-PQCC-N64	2		e4
X430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.65 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.45 V	70 Cel		0 Cel			QUAD	1 mm		4 mm						4 mm		CMOS	1.5 V		.5 mm	S-PQCC-N24
SP1ML-915	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	NO	3.6 V		MICROELECTRONIC ASSEMBLY		1.8 V	85 Cel		-40 Cel			DUAL	2.5 mm		13.4 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS	3 V		1.5 mm	R-XDMA-N16
UCD3138ARGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	1 mm		9 mm		0	2 MHz	30	260	9 mm		CMOS	3.3 V	I2C; UART	.5 mm	S-PQCC-N64	2		e4
UCD3138ARMHR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	.8 mm		6 mm		0	2 MHz	30	260	6 mm		CMOS	3.3 V	I2C; UART	.5 mm	S-PQCC-N40	2		e4
UCD3138ARMHT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	.8 mm		6 mm		0	2 MHz	30	260	6 mm		CMOS	3.3 V	I2C; UART	.5 mm	S-PQCC-N40	2		e4
CC1310F32RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm				NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3		e4
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3		e4
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		4 mm				NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3		e4
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm				NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3		e4
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3		e4
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		4 mm				NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3		e4
DLPC910ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel		0 Cel			BOTTOM	3 mm		27 mm						27 mm		CMOS	1 V	I2C; USB	1 mm	S-PBGA-B676
MSP430F6749IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		14 mm		0	25 MHz	30	260	14 mm		CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		e4
DLPC3438CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM	1 mm		13 mm				30	260	13 mm		CMOS	1.1 V		.8 mm	S-PBGA-B201	3		e1
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM	1 mm		13 mm				30	260	13 mm		CMOS	1.1 V		.8 mm	S-PBGA-B201	3		e1
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY		1.71 V						BOTTOM				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY							CMOS				R-PBGA-B49
MCIMX6G0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY	BGA289,17X17,32	1.15 V	95 Cel		0 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY						TIN SILVER COPPER		BOTTOM							30	250			CMOS				X-PBGA-B760	3	1500 rpm	e1
MCIMX6DP4AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel		-40 Cel			BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6DP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.			40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP6AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6QP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.			40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		7 mm				40	260	7 mm		CMOS	1.25 V		.5 mm	S-PQCC-N48	2		e3
MCIMX6G1AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G1AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G2AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G2AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G1CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3		e2
MCIMX6G2CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.23 mm		9 mm				40	260	9 mm		CMOS			.5 mm	S-PBGA-B272	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G3CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY			125 Cel		-40 Cel			BOTTOM											CMOS				S-PBGA-B484
XCZU9EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS	.85 V			R-PBGA-B900	4		e1
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel		0 Cel			BOTTOM	1.1 mm		12 mm				40	260	12 mm		CMOS	1.1 V		.4 mm	S-PBGA-B488	3
MCIMX7D3EVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	105 Cel		-20 Cel			BOTTOM	1.1 mm		12 mm				40	260	12 mm		CMOS	1.1 V		.4 mm	S-PBGA-B488	3

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.