Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
MIMX8MN5DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM		1.25 mm	14 mm					40	260	14 mm	CMOS		1 V			.5 mm	S-PBGA-B486	3	e2
MIMX8MN6DVTJZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel			BOTTOM		1.25 mm	14 mm							14 mm	CMOS		1 V			.5 mm	S-PBGA-B486
MIMX8MN6DVTJZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel			BOTTOM		1.25 mm	14 mm							14 mm	CMOS		1 V			.5 mm	S-PBGA-B486
ST33HTPH2E28AHD0	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel	-40 Cel			DUAL		1.2 mm	4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE			NOT SPECIFIED	NOT SPECIFIED	9.7 mm	CMOS		1.8 V			.65 mm	R-PDSO-G28
ST33HTPH2028AHD1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel	-40 Cel			DUAL		1.2 mm	4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE			NOT SPECIFIED	NOT SPECIFIED	9.7 mm	CMOS		1.8 V			.65 mm	R-PDSO-G28
MCIMX6Z0DVM09ABR	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel			BOTTOM		1.32 mm	14 mm							14 mm	CMOS					.8 mm	S-PBGA-B289
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm	2 mm							3 mm	CMOS				SPI	.5 mm	R-PDSO-N8
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm	7 mm		3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS		1.8 V		I2C, QSPI, UART	.65 mm	S-PBGA-B84
MCIMX6DP4AVT8AAR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel			BOTTOM		2.16 mm	21 mm					40	260	21 mm	CMOS		1.4 V			.8 mm	S-PBGA-B624	3
MCIMX6DP4AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel			BOTTOM		2.16 mm	21 mm					40	260	21 mm	CMOS		1.4 V			.8 mm	S-PBGA-B624	3
MCIMX6DP6AVT8AAR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm	21 mm					40	260	21 mm	CMOS		1.4 V			.8 mm	S-PBGA-B624	3	e1
MCIMX6DP6AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm	21 mm					40	260	21 mm	CMOS		1.4 V			.8 mm	S-PBGA-B624	3	e1
MCIMX6X4AVM08ABR	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.52 mm	19 mm					40	260	19 mm	CMOS					.8 mm	S-PBGA-B529	3	e1
MGM210PB22JIA2	Silicon Labs	SYSTEM ON CHIP
MPFS250TL-FCG1152I	Microchip Technology	SoC FPGA		BALL	1152		RECTANGULAR	PLASTIC/EPOXY	YES							100 Cel	-40 Cel			BOTTOM											CMOS						R-PBGA-B1152
BM83SM1-00TB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel			UNSPECIFIED		2.5 mm	15 mm							32 mm	CMOS		3.8 V			1 mm	R-XXMA-N50
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm	14.73 mm							21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm	14.73 mm							21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm	14.73 mm							21.72 mm	CMOS		3.3 V				R-XXMA-N28
EFR32ZG23A010F512GM40-C	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm							5 mm	CMOS		3.3 V			.4 mm	S-XQCC-N40
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel	-30 Cel	TIN SILVER COPPER		BOTTOM									260		CMOS		1 V				S-PBGA-B176	3	e1
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY		1.116 V	55 Cel	0 Cel			BOTTOM		2.36 mm	23 mm							23 mm	CMOS		1.2 V			1 mm	S-PBGA-B419
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO	CHIP CARRIER		2.3 V	70 Cel	-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	17.5 mm	0		0		30	260	20.5 mm	CMOS	4-Ch 12-Bit	3.3 V	NO	I2C; SPI; UART	1.27 mm	R-XBCC-B63	3	e4	25
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm	27 mm			16	20 MHz			27 mm	CMOS		1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
XC7Z010-L1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.5 mm	13 mm							13 mm	CMOS		1 V			.8 mm	S-PBGA-B225
XC7Z010-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	17 mm							17 mm	CMOS		1 V			.8 mm	S-PBGA-B400
XC7Z015-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z015-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z015-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z015-3CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z020-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	17 mm							17 mm	CMOS		1 V			.8 mm	S-PBGA-B400
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		1.6 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B484
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z030-2SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z030-3SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM		2.54 mm	23 mm							23 mm	CMOS		1 V			1 mm	S-PBGA-B484
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM		2.54 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM		3.24 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM		2.44 mm	19 mm							19 mm	CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM		2.54 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM		2.54 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM		3.24 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM		3.24 mm	27 mm							27 mm	CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel			BOTTOM		3.35 mm	31 mm							31 mm	CMOS		1 V			1 mm	S-PBGA-B900

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.