Other Function uPs,uCs & Peripheral ICs

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MSP430F67491IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		14 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY			30	260	14 mm		CMOS		3.3 V			.5 mm		S-PQFP-G100	3			e4
NN325TRHARQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1 mm		6 mm		0	16 MHz	30	260	6 mm	1024	CMOS		2.7 V		I2C; SPI; UART	.5 mm		S-PQCC-N40	3			e4
TMS320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	1.75 mm		3.9 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V		I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V					IN-LINE		4.5 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	5.08 mm		7.62 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	260	9.81 mm		BIPOLAR		5 V		I2C	2.54 mm		R-PDIP-T8	1	Not Qualified		e4
TMS320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TIR1000PWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm		CMOS		3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified		e4
TMS320DM335ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm		32		30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B337	3	Not Qualified		e1
AT43USB326-AU	Atmel	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES					5	FLATPACK	QFP48,.35SQ,20		85 Cel	-40 Cel			QUAD												40 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQFP-G48		Not Qualified
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm						19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified		e3
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm					260	8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		5	IN-LINE	DIP14,.3	4.5 V	125 Cel	-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm						19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified		e3
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm					260	19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified		e3
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm						19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified		e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified		e3
DM368ZCEDZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3			e1
DM368ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3			e1
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM8147SCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, HEAT SINK/SLUG		3.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY	48		NOT SPECIFIED	250	23 mm		CMOS		3.3 V		ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B684	4		1000 rpm	e1
OMAPL132EZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL132EZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL132EZWTA2R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL132EZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138EZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361	3			e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCED4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
SN3490586	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.