Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
TNETV1647GSTZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		e1
TNETV6446AINZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3		e1
UCD3138128PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
SN74LVT8986PM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		10 mm			0	30	260	10 mm		BICMOS		3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G64	3	Not Qualified	e4
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8	6 mm				30	260	6 mm	8192	CMOS		3 V		SPI; USART; USB	.5 mm		S-PQCC-N40	3		e4	21
DM365ZCES	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
DM365ZCEW	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
HPA01215RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		6 mm		TIMER(4)		30	260	6 mm	8192	CMOS		3 V			.5 mm		S-PQCC-N40	3		e4	23
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		6 mm		TIMER(4)		30	260	6 mm	8192	CMOS		3 V			.5 mm		S-PQCC-N40	3		e4	23
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
TMS320F28PLC83PNTR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
TMS320F28PLC83PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
TMS320F28PLC84PNTR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
TMS320F28PLC84PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		12 mm				30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467CCUT7TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
TMSDM6467CCUTV6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
VCBU68WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3		e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
VCBUP7CT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4		e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32	30	260	13 mm		CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
VS3674UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3		e1
DM355SZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM355ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM6467ZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel			BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM6467ZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm			32	30	260	13 mm		CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
OMAP3503DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel	0 Cel			BOTTOM	1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.8 V	Graphics Processors		.8 mm		S-PBGA-B423		Not Qualified
OMAP3503DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.8 V	Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified	e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	.9 mm		12 mm				30	260	12 mm		CMOS		1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified	e1
OMAP3515DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	.9 mm		12 mm				30	260	12 mm		CMOS		1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified	e1
OMAP3515DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel	0 Cel			BOTTOM	1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.8 V	Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
SN74LVT8996IPWREP	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm		4.4 mm			0	30	260	7.8 mm		BICMOS		3.3 V	Other Microprocessor ICs		.65 mm		R-PDSO-G24	1	Not Qualified	e4
AD6620ASZ-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN		QUAD	3.4 mm		14 mm				40	260	14 mm		CMOS		3.3 V	DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified	e3
MXD1210CSA-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL	1.75 mm		3.9 mm						4.9 mm		CMOS	.5 mA	5 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e0
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN		QUAD	3.4 mm		14 mm					260	14 mm		CMOS		3.3 V	DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified	e3
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	4.75 V	85 Cel	-40 Cel	Matte Tin (Sn)		QUAD	1 mm		4 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			20	260	4 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N24	3	Not Qualified	e3
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			40	260	5 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.