Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		31 mm					31 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel			BOTTOM	3.35 mm		31 mm					31 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		31 mm					31 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel			BOTTOM	3.35 mm		31 mm					31 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		31 mm					31 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.1 mm		35 mm					35 mm		CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V		1 mm	S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	.95 V		.65 mm	S-PBGA-B491	3	e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4377BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V		.65 mm	S-PBGA-B491	3	e1
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.26 V		.65 mm	S-PBGA-B491	3	e1
CC3000MODT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	4.8 V	MICROELECTRONIC ASSEMBLY		2.7 V	70 Cel		-20 Cel			QUAD	2 mm		13.5 mm	SEATED HGT-NOM				16.3 mm		CMOS	3.6 V			R-XQMA-N46
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD	1 mm		5 mm					5 mm		CMOS	5 V		.5 mm	S-XQCC-N32
STWBC	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD	1 mm		5 mm					5 mm		CMOS	5 V		.5 mm	S-XQCC-N32
CC1310F32RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm			30	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3	e4
CC1310F64RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm			30	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3	e4
ADUCM330WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD	1 mm		6 mm					6 mm		CMOS			.5 mm	S-XQCC-N32
ADUCM331WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD	1 mm		6 mm					6 mm		CMOS			.5 mm	S-XQCC-N32
CMX7341Q3	Cml Microcircuits	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD	1 mm		6 mm					6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N48
MSP430F67621AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	12 mm		0	30	260	12 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67621AIPN	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	12 mm		0	30	260	12 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G80	3	e4
MSP430F67621AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	14 mm		0	30	260	14 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4
MSP430F67621AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	4	14 mm		0	30	260	14 mm	4096	CMOS	3.3 V	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	e4

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.