| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
262144 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
HARDWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
SPI |
2097152 bit |
2.7 V |
ALSO AVAILABLE WITH 2.3VMIN@50MHZ |
NOR TYPE |
.00002 Amp |
4.9 mm |
3 |
||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
549755813888 bit |
2.7 V |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
549755813888 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
137438953472 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
68719476736 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.1 mm |
200 MHz |
11.5 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
105 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
105 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
68719476736 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
5 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE |
BGA100,10X17,40 |
5 |
1 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
18 mm |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
515396075520 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
4123168604160 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
515396075520 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
4123168604160 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
3518437208883 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.2TX8 |
3.2T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
28147497671065 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4222124650659 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.84TX8 |
3.84T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
33776997205278 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8444249301319 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
7.68TX8 |
7.68T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
67553994410557 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
858993459200 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
800GX8 |
800G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
6871947673600 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2111062325329 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
16888498602639 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
3518437208883 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.2TX8 |
3.2T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
28147497671065 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
7036874417766 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
6.4TX8 |
6.4T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
56294995342131 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2111062325329 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
16888498602639 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4222124650659 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.84TX8 |
3.84T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
33776997205278 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
429496729600 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
400GX8 |
400G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
3435973836800 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
515396075520 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
4123168604160 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1030792151040 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
960GX8 |
960G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
8246337208320 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2111062325329 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
16888498602639 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2111062325329 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
16888498602639 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
7036874417766 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
6.4TX8 |
6.4T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
56294995342131 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8444249301319 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
7.68TX8 |
7.68T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
67553994410557 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
429496729600 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
400GX8 |
400G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
3435973836800 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
858993459200 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
800GX8 |
800G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
6871947673600 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4222124650659 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.84TX8 |
3.84T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
33776997205278 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
7036874417766 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
6.4TX8 |
6.4T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
56294995342131 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
858993459200 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
800GX8 |
800G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
6871947673600 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1030792151040 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
960GX8 |
960G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
8246337208320 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4222124650659 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3.84TX8 |
3.84T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
33776997205278 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1759218604441 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.6TX8 |
1.6T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
14073748835532 bit |
TLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1759218604441 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.6TX8 |
1.6T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
14073748835532 bit |
TLC NAND TYPE |
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|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2111062325329 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1.92TX8 |
1.92T |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
16888498602639 bit |
TLC NAND TYPE |
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|
Micron Technology |
FLASH MODULE |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1030792151040 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
960GX8 |
960G |
0 Cel |
UNSPECIFIED |
R-XXMA-N |
8246337208320 bit |
TLC NAND TYPE |
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|
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
94 mA |
268435456 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
BOTTOM/TOP |
2147483648 bit |
2.7 V |
NOR TYPE |
.00013 Amp |
8 mm |
3 |
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|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
128GX8 |
128G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
1 mm |
200 MHz |
11.5 mm |
1099511627776 bit |
1.7 V |
NAND TYPE |
13 mm |
1.8 |
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|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
.9 mm |
200 MHz |
11.5 mm |
549755813888 bit |
1.7 V |
NAND TYPE |
13 mm |
1.8 |
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|
|
Winbond Electronics |
FLASH |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.64 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
268435456 bit |
2.7 V |
NOR TYPE |
.00012 Amp |
10.31 mm |
3 |
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|
|
Advantech |
FLASH MODULE |
COMMERCIAL |
52 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
137438953472 words |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128GX8 |
128G |
0 Cel |
SINGLE |
R-XSMA-N52 |
4.2 mm |
30 mm |
1099511627776 bit |
MLC NAND TYPE |
50.8 mm |
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|
|
Advantech |
FLASH MODULE |
INDUSTRIAL |
52 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
68719476736 words |
8 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64GX8 |
64G |
-40 Cel |
SINGLE |
R-XSMA-N52 |
4.2 mm |
30 mm |
549755813888 bit |
MLC NAND TYPE |
50.8 mm |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.